OPTOELECTRONIC COMPONENT
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Abstract
A method of producing an optoelectronic component includes providing at least one optoelectronic semiconductor chip; arranging a starting layer on the semiconductor chip, wherein the starting layer is present in the form of a film and includes a first phosphor; arranging a conversion element on the starting layer, wherein the conversion element includes a second phosphor; and curing the starting layer to form a connection layer.
10 Citations
34 Claims
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1-17. -17. (canceled)
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18. A method of producing an optoelectronic component comprising:
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providing at least one optoelectronic semiconductor chip; arranging a starting layer on the semiconductor chip, wherein the starting layer is present in the form of a film and comprises a first phosphor, and the starting layer is arranged on the semiconductor chip in a frozen state as a film lamina; arranging a ceramic conversion element on the starting layer, wherein the conversion element comprises a second phosphor; and curing the starting layer to form a connection layer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of producing an optoelectronic component comprising:
- providing at least one optoelectronic semiconductor chip;
arranging a starting layer on the semiconductor chip, wherein the starting layer is present in the form of a film and comprises a first phosphor;
arranging a conversion element on the starting layer, wherein the conversion element comprises a second phosphor; and
curing the starting layer to form a connection layer.
- providing at least one optoelectronic semiconductor chip;
Specification