Method for Improving Chemical Resistance of Polymerized Film, Polymerized Film Forming Method, Film Forming Apparatus, and Electronic Product Manufacturing Method

• US 20150240121A1
• Filed: 02/26/2015
• Published: 08/27/2015
• Est. Priority Date: 02/27/2014
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: SUGITA, Kippei, YAMAGUCHI, Tatsuya, MORISADA, Yoshinori, FUJIKAWA, Makoto
• Granted Patent: US 9,708,507 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/0254 After-treatment
• CPC Class Codes: C08G 73/105 with oxygen only in the diamino moiety
• CPC Class Codes: C08G 73/1071 Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C23C 16/30 Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
• CPC Class Codes: C23C 16/56 After-treatment
• CPC Class Codes: H01L 21/02063 the processing being the formation of vias or contact holes
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A method for improving a chemical resistance of a polymerized film, which is formed on a surface of a target object and to be processed by a chemical, includes: consecutively performing a treatment for improving the chemical resistance of the polymerized film subsequent to formation of the polymerized film within a processing chamber of a film forming apparatus where the polymerized film is formed, without unloading the target object from the processing chamber.

Claims

1. A method for improving a chemical resistance of a polymerized film, which is formed on a surface of a target object and to be processed by a chemical, the method comprising:

consecutively performing a treatment for improving the chemical resistance of the polymerized film subsequent to formation of the polymerized film within a processing chamber of a film forming apparatus where the polymerized film is formed, without unloading the target object from the processing chamber.

2. The method of claim 1, wherein the polymerized film is a polyimide film and the chemical contains an alkaline compound.

3. The method of claim 1, wherein the treatment for improving the chemical resistance is a heat treatment which is performed at a temperature higher than a formation temperature of the polymerized film.

4. The method of claim 3, wherein the heat treatment comprises:

increasing a temperature of the target object accommodated in the processing chamber to be higher than the formation temperature of the polymerized film by increasing an output of a heating device provided in the film forming apparatus to be higher than an output used during the formation of the polymerized film;

suppressing an increase in the temperature of the target object accommodated in the processing chamber by turning off the heating device and by turning on a cooling device provided in the film forming apparatus; and

returning an internal pressure of the processing chamber to an atmospheric pressure by controlling an exhaust device provided in the film forming apparatus.

5. The method of claim 4, wherein increasing a temperature of the target object and suppressing an increase in the temperature of the target object include repeating introduction of an inert gas into the processing chamber and discharge of the inert gas from the processing chamber.

6. The method of claim 3, wherein a temperature of the target object during the heat treatment is kept in a range equal to or higher than the formation temperature of the polymerized film and lower than a pyrolysis temperature of the polymerized film.

7. A polymerized film forming method for forming a polymerized film on a surface of a target object, the method comprising:

accommodating the target object in a processing chamber of a film forming apparatus;

forming the polymerized film on the surface of the target object within the processing chamber; and

consecutively performing a treatment for improving a chemical resistance of the polymerized film subsequent to forming the polymerized film within the processing chamber of the film forming apparatus where the polymerized film is formed, without unloading the target object from the processing chamber.

8. The method of claim 7, wherein the polymerized film is a polyimide film.

9. The method of claim 7, wherein the treatment for improving the chemical resistance of the polymerized film is a heat treatment which is performed at a temperature higher than a formation temperature of the polymerized film in forming the polymerized film.

10. The method of claim 9, wherein the heat treatment comprises:

increasing a temperature of the target object accommodated in the processing chamber to be higher than the formation temperature of the polymerized film by increasing an output of a heating device provided in the film forming apparatus to be higher than an output used during forming the polymerized film;

suppressing an increase in the temperature of the target object accommodated in the processing chamber by turning off the heating device and by turning on a cooling device provided in the film forming apparatus; and

returning an internal pressure of the processing chamber to an atmospheric pressure by controlling an exhaust device provided in the film forming apparatus.

11. The method of claim 10, wherein increasing a temperature of the target object and suppressing an increase in the temperature of the target object include repeating introduction of an inert gas into the processing chamber and discharge of the inert gas from the processing chamber.

12. The method of claim 9, wherein a temperature of the target object during the heat treatment is kept in a range equal to or higher than the formation temperature of the polymerized film and lower than a pyrolysis temperature of the polymerized film.

19. A film forming apparatus for forming a polymerized film on a surface of a target object using a first source gas containing a first monomer and a second source gas containing a second monomer, the apparatus comprising:

a processing chamber that accommodates the target object;

a film forming process gas supply mechanism that supplies the first source gas and the second source gas into the processing chamber;

an inert gas supply mechanism that supplies an inert gas into the processing chamber;

a heating device that heats the target object;

a cooling device that suppresses heating of the target object;

an exhaust device that evacuates an interior of the processing chamber; and

a controller that controls the film forming process gas supply mechanism, the inert gas supply mechanism, the heating device, the cooling device, and the exhaust device,

wherein the controller controls the film forming process gas supply mechanism, the inert gas supply mechanism, the heating device, the cooling device, and the exhaust device to perform the polymerized film forming method of claim 7.

13. An electronic product manufacturing method for manufacturing an electronic product using a target object having an electric element arranged therein, the method comprising:

forming a polymerized film on a surface of the target object;

performing a treatment for improving a chemical resistance of the polymerized film with respect to the polymerized film;

performing an etching process with respect to the polymerized film having an improved chemical resistance; and

performing a cleaning process using a cleaning agent with respect to the polymerized film having been subjected to the etching process,

wherein the treatment for improving the chemical resistance of the polymerized film is consecutively performed subsequent to formation of the polymerized film within a processing chamber where the polymerized film is performed, without unloading the target object having the polymerized film formed thereon from the processing chamber.

14. The method of claim 13, wherein the polymerized film is a polyimide film and the cleaning agent contains an alkaline compound.

15. The method of claim 13, wherein the treatment for improving the chemical resistance of the polymerized film is a heat treatment which is performed at a temperature higher than a formation temperature of the polymerized film in forming the polymerized film.

16. The method of claim 15, wherein the heat treatment comprises:

increasing a temperature of the target object accommodated in the processing chamber to be higher than the formation temperature of the polymerized film by increasing an output of a heating device provided in a film forming apparatus to be higher than an output used during forming the polymerized film;

suppressing an increase in the temperature of the target object accommodated in the processing chamber by turning off the heating device and by turning on a cooling device provided in the film forming apparatus; and

returning an internal pressure of the processing chamber to an atmospheric pressure by controlling an exhaust device provided in the film forming apparatus.

17. The method of claim 16, wherein increasing a temperature of the target object and suppressing an increase in the temperature of the target object include repeating introduction of an inert gas into the processing chamber and discharge of the inert gas from the processing chamber.

18. method of claim 15, wherein a temperature of the target object during the heat treatment is kept in a range equal to or higher than the formation temperature of the polymerized film and lower than a pyrolysis temperature of the polymerized film.