Test Circuit And Method
First Claim
1. A method, comprising:
- for a plurality of dies on a test fixture, wherein each of the dies includes a plurality of first antennas, determining an antenna distance between each of the first antennas of one of the dies and every one of the first antennas of the other dies, wherein the dies are arranged in an array and positionally correspond to a plurality of under-test dies of an under-test device;
categorizing the dies into a plurality of die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold; and
sequentially performing a plurality of test processes on the under-test device by first antennas of the dies of the die groups, and each of the test processes is performed according to signal transmissions between the first antennas and a plurality of second antennas of the under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas.
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Accused Products
Abstract
A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.
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Citations
20 Claims
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1. A method, comprising:
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for a plurality of dies on a test fixture, wherein each of the dies includes a plurality of first antennas, determining an antenna distance between each of the first antennas of one of the dies and every one of the first antennas of the other dies, wherein the dies are arranged in an array and positionally correspond to a plurality of under-test dies of an under-test device; categorizing the dies into a plurality of die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold; and sequentially performing a plurality of test processes on the under-test device by first antennas of the dies of the die groups, and each of the test processes is performed according to signal transmissions between the first antennas and a plurality of second antennas of the under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A circuit comprising:
a plurality of dies each comprising; a plurality of antennas; and at least one via array formed between at least two of the antennas to separate the antennas. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method comprising:
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transmitting first forced signals from a plurality of first antennas of a planar test fixture to a plurality of second antennas of a first wafer layer of an under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas; receiving first feedback signals from the second antennas by the first antennas; and determining a first surface warping condition of the under-test device according to a first received power of each of the first feedback signals. - View Dependent Claims (17, 18, 19, 20)
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Specification