SELF-POWERED SENSING AND TRANSMITTING DEVICE AND METHOD OF FABRICATING THE SAME

• US 20150244344A1
• Filed: 02/24/2014
• Published: 08/27/2015
• Est. Priority Date: 02/24/2014
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Energy Incorporated (Siemens AG)
• Inventors: Mitchell, David J., Kulkarni, Anand A.
• Granted Patent: US 9,350,319 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F01D 17/02 Arrangement of sensing elements
• CPC Class Codes: F01D 21/003 Arrangements for testing or measuring for measuring vibrations G01H
• CPC Class Codes: F05D 2230/90 Coating; Surface treatment
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: G01M 15/14 Testing gas-turbine engines or jet-propulsion engines
• CPC Class Codes: G01N 2291/2693 Rotor or turbine parts
• CPC Class Codes: G01N 29/2462 Probes with waveguides, e.g. SAW devices
• CPC Class Codes: H03H 9/25 Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36
• CPC Class Codes: H04Q 9/00 Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Abstract

A self-powered sensing and transmitting circuit (50) including a power element (44) and a sensing element (46) that is powered by the power element for generating a sensor signal responsive to a local operating environment The circuit also includes a transmitting element (48) powered by the power element for transmitting an output signal responsive to the sensor signal to a receiving location (33, 55) remote from the circuit The power element, sensing element and transmitting element of the circuit are arranged in a generally planar and non-integrated circuit configuration formed on a substrate (57) component exposed to operating temperatures at or exceeding 650° C.

Claims

1. A self-powered sensing and transmitting circuit, comprising

a power element,

a sensing element powered by the power element for generating a sensor signal responsive to a local operating environment,

a transmitting element powered by the power element for transmitting an output signal responsive to the sensor signal to a receiving location remote from the module, and

wherein the power element, sensing element and transmitting element are arranged in a generally planar and non-integrated circuit configuration and formed on a substrate component configured to operate at temperatures at or exceeding 650°

C.

2. The circuit of claim 1 further comprising

a dielectric layer,

a piezoelectric substrate formed on the dielectric layer, and

wherein the sensing element is formed on the piezoelectric substrate

3. The circuit of claim 1 wherein the power generating element is a thermoelectric power generating element

4. The circuit of claim 3 wherein the power generating element is a thermocouple

5. The circuit of claim 2 wherein the sensing element comprises

an input interdigital transducer formed on the piezoelectric substrate in electrical communication with the power element, and

an output interdigital transducer formed on the piezoelectric substrate and in electrical communication with the transmitting element

6. A circuit comprising

a component substrate,

a power element,

a sensing element powered by the power element for generating a sensor signal responsive to a local operating environment,

a transmitting element powered by the power element for transmitting an output signal responsive to the sensor signal to a receiving location remote from the from the component substrate, and

wherein the power element, sensing element and transmitting element are arranged in a generally planar and non-integrated circuit configuration on the component substrate and the component and component substrate are configured to operate in an environment having operating temperatures exceeding 650°

C.

7. The circuit of claim 6 further comprising

a dielectric layer,

a piezoelectric substrate formed on the dielectric layer, and,

wherein the sensing element is formed on the piezoelectric substrate

8. The circuit of claim 6 wherein the power generating element is a thermoelectric power generating element

9. The circuit of claim 8 wherein the power generating element is a thermocouple

10. The circuit of claim 7 wherein the sensing element comprises

an input interdigital transducer formed on the piezoelectric substrate in electrical communication with the power element, and,

an output interdigital transducer formed on the piezoelectric substrate and in electrical communication with the transmitting element

11. A method comprising:

providing a turbine component having a component substrate;

selectively depositing a first material onto a surface of the component substrate to form a power element,

selectively depositing a second material onto a surface of the component substrate to form a sensing element connected to the power element,

selectively depositing a third material onto the surface of the component substrate to form a transmitting element connected to the sensing element, and

wherein the power element, sensing element and transmitting element are arranged in a generally planar and non-integrated circuit configuration

12. The method of claim 11 further comprising depositing a dielectric material on the component substrate before selectively depositing the first, second and third materials onto the substrate

13. The method of claim 12 further comprising depositing a piezoelectric material on the dielectric material before depositing the second material to form a piezoelectric substrate for receiving the second material

14. The method of claim 13 further comprising sequentially masking the dielectric material and piezoelectric substrate according to predetermined conductive patterns of the power element, sensing element and transmission element