PACKAGE FOR A DIFFERENTIAL PRESSURE SENSING DIE

• US 20150247776A1
• Filed: 02/28/2014
• Published: 09/03/2015
• Est. Priority Date: 02/28/2014
• Status: Active Grant

• Current Assignee: Measurement Specialties Incorporated (TE Connectivity Limited)
• Original Assignee: Measurement Specialties Incorporated (TE Connectivity Limited)
• Inventors: Wagner, David E., Valentini, John J.
• Granted Patent: US 9,593,995 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 19/0069 from the sensor to its support
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Claims

1. A package for receiving a differential pressure sensing die, the die comprising a semiconductor die having an integral diaphragm adapted to measure a differential pressure applied to opposing sides of the diaphragm, the package comprising:

a first housing member configured to receive the differential pressure sensing die;

at least one second housing member, the first housing member and the at least one second housing member configured to mate with one another to define a housing, the housing having defined therein an interior volume for containing said differential pressure sensing die;

a first port defined through a wall of said first housing member, said first port positioned to be aligned with an aperture defined in a first side of said differential pressure sensing die when said differential pressure sensing die is contained in said first housing member; and

a second port defined through a wall of said second housing member, said second port positioned to be aligned with a second aperture defined in a second side of said differential pressure sensing die, opposite said first side, when said first housing member is mated with said first housing member.

2. The package of claim 1, where in said first and second housing members comprise a plastic.

3. The package of claim 1, further comprising:

at least one electrical connection pin extending outward from the package, electrically connected to an electrical conductor through the housing, for connection to a lead in electrical communication with a piezo-resistive element formed in a surface of said diaphragm, wherein said package is configured to maintain said electrical connecting pin physically isolated from contact with a fluid introduced at either the first port or the second port.

4. The package of claim 3, wherein said at least one electrical connection pin is configured as a single inline package (SIP).

5. The package of claim 3, wherein said at least one electrical connection pin is configured as a dual inline package (DIP).

6. The package of claim 1, further comprising:

a first fitting, configured to be threadingly engaged to an internal thread defined in said first port;

a first O-ring, disposed between said first fitting and said first port defined in said first housing member;

a second fitting, configured to be threadingly engaged to an internal thread defined in said second port; and

a second O-ring, disposed between said second fitting and said second port defined in said second housing member.

7. The package of claim 1, further comprising:

at least one flanged portion integrally formed with one of the housing members and having a hole defined therein for receiving a fastener for surface mounting said package.

8. The package of claim 7, wherein said flanged portion is configured to permit surface mounting of the package on a frame of a vehicle.

9. The package of claim 1, wherein said first port is configured to be connected to an inlet of an oil filter of a vehicle.

10. The package of claim 9, wherein said second port is configured to be connected to an outlet of said oil filter.

11. A package for receiving a differential pressure sensing die, the die comprising a semiconductor die having an integral diaphragm adapted to measure a differential pressure applied to opposing sides of the diaphragm, the package comprising:

a housing, defined by one or more housing members, the housing having a wall defining an interior volume configured to support and contain the differential pressure sensing die;

a first port defined through the wall of said housing, said first port positioned to be aligned with an aperture defined in a first side of said differential pressure sensing die when said differential pressure sensing die is contained in the housing;

a second port defined through the wall of said housing, said second port positioned to be aligned with a second aperture defined in a second side of said differential pressure sensing die when the differential pressure sensing die is contained in the housing, opposite said first side, when said first housing member is mated with said first housing member; and

at least one electrical connection pin extending outward from the housing, and in electrical communication through the wall for connection to a lead in electrical communication with a piezo-resistive element formed in a surface of said diaphragm.

12. The package of claim 11, wherein said package is configured to maintain said electrical connecting pin physically isolated from contact with a fluid introduced at either the first port or the second port.

13. The package of claim 11, wherein said at least one electrical connection pin is configured as a single inline package (SIP).

14. The package of claim 11, wherein said at least one electrical connection pin is configured as a dual inline package (DIP).

15. The package of claim 11, further comprising:

a first fitting, configured to be threadingly engaged to an internal thread defined in said first port;

a first O-ring, disposed between said first fitting and said first port;

a second fitting, configured to be threadingly engaged to an internal thread defined in said second port; and

a second O-ring, disposed between said second fitting and said second port.

16. The package of claim 11, further comprising:

at least one flanged portion rigidly attached to one of the housing members and having a hole defined therein for receiving a fastener for surface mounting said package.

17. The package of claim 16, wherein said flanged portion is configured to permit surface mounting of the package on a frame of a vehicle.

18. The package of claim 11, wherein said first port is configured to be connected to an inlet of an oil filter of a vehicle, to permit fluid communication from the inlet to a side of the diaphragm.

19. The package of claim 18, wherein said second port is configured to be connected to an outlet of said oil filter, to permit fluid communication from the inlet to an opposite side of the diaphragm.