VERSATILE AND RELIABLE INTELLIGENT PACKAGE

• US 20150249059A1
• Filed: 09/23/2013
• Published: 09/03/2015
• Est. Priority Date: 09/21/2012
• Status: Active Grant

• Current Assignee: Stora Enso Oyj
• Original Assignee: Stora Enso Oyj
• Inventors: Maijala, Juha
• Granted Patent: US 9,773,743 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61J 1/035 Blister-type containers blisters in general B65D75/36
• CPC Class Codes: A61J 2200/30 Compliance analysis for taking medication
• CPC Class Codes: A61J 2205/60 using magnetic or electronic identifications, e.g. chips, RFID, electronic tags
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 25/00 Details of other kinds or types of rigid or semi-rigid containers
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0292 having a modifiable lay-out, i.e. adapted for engineering changes or repair H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/053 : Tails
• CPC Class Codes: H05K 2201/056 : Folded around rigid support or component
• CPC Class Codes: H05K 2201/09045 : Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2201/0909 : Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09127 : PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 2201/09254 : Branched layout
• CPC Class Codes: H05K 2201/09263 : Meander
• CPC Class Codes: H05K 2201/09954 : More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/0999 : Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 2203/0195 : Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0228 : Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/301 : by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/305 : Affixing by adhesive

Abstract

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Claims

1. A package, comprising:

a body,

an electrically conductive pattern supported by said body, and

an interface portion configured to receive a module to a removable attachment with said package;

wherein said electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

2. A package according to claim 1, wherein said wireless coupling pattern is one of:

a capacitive coupling patch, an inductive coupling loop.

3. A package according to claim 2, comprising:

a ground track that is supported by said body and comprises a ground coupling pattern located at least partly within said interface portion,

wherein said ground coupling pattern is located at an opposite end of at least a part of said interface portion than said wireless coupling pattern.

4. A package according to claim 3, comprising:

an impedance element coupled between said electrically conductive pattern and said ground track, and

a breakable portion of said electrically conductive pattern;

wherein said breakable portion is located between said wireless coupling pattern and said impedance element.

5. A package according to claim 4, wherein said impedance element is a capacitance.

6. A package according to claim 4, wherein said breakable portion extends across a perforation in said body.

7. A package according to claim 4, wherein said breakable portion extends across a breakable wall of a compartment defined by said body.

8. A package according to claim 1, wherein:

said electrically conductive pattern comprises at least two wireless coupling patterns,

each of said at least two wireless coupling patterns constitutes one half of a wireless coupling arrangement, and

said at least two wireless coupling patterns are located differently within said interface portion.

9. A package according to claim 1, wherein:

the package comprises two electrically conductive patterns, each of which is configured to behave in the same way as a response to a particular change in the package,

each of said two electrically conductive patterns comprises, at least partly within said interface portion, a respective wireless coupling pattern that constitutes one half of a wireless coupling arrangement, and

said wireless coupling patterns are located differently within said interface portion.

10. A package according to claim 8, wherein:

the locations of said wireless coupling patterns within said interface portion are separated by 90 or 180 degrees turns around an axis of symmetry of said interface portion.

11. A package according to claim 1, wherein:

said body comprises a layer of fibrous or plastic material that comprises a plane portion and a bendable portion,

in an open configuration said plane portion and said bendable portion are both within the same plane, and

in a closed configuration said bendable portion is bent out of the plane of said plane portion to define a module compartment limited by at least part of both said plane portion and said bendable portion.

12. A package according to claim 11, wherein:

said layer of fibrous or plastic material comprises multiple bendable portions that in said open configuration are within the same plane as said plane portion,

in said closed configuration said bendable portions define, together with at least part of said plane portion, a closed module compartment.

17. A package according to claim 5, wherein said breakable portion extends across a perforation in said body.

18. A package according to claim 5, wherein said breakable portion extends across a breakable wall of a compartment defined by said body.

19. A package according to claim 2, wherein:

said electrically conductive pattern comprises at least two wireless coupling patterns,

each of said at least two wireless coupling patterns constitutes one half of a wireless coupling arrangement, and

said at least two wireless coupling patterns are located differently within said interface portion.

20. A package according to claim 3, wherein:

said electrically conductive pattern comprises at least two wireless coupling patterns,

each of said at least two wireless coupling patterns constitutes one half of a wireless coupling arrangement, and

said at least two wireless coupling patterns are located differently within said interface portion.

13. A communications module for a package, comprising:

a module body,

at an outer surface of said module body, one or more wireless coupling patterns that constitute a half of a wireless coupling arrangement, and

a sensor of electric characteristics, said sensor being configured to direct an excitation signal to said half of a wireless coupling arrangement and to measure a response to said excitation signal.

14. A communications module according to claim 13, wherein:

said sensor is configured to direct an oscillating excitation signal to said half of a wireless coupling arrangement and to measure a frequency response to said oscillating excitation signal.

15. A communications module according claim 13, comprising a long distance wireless communications transmitter and a processor configured to transmit, over said long distance wireless communications transmitter, information indicative of measured responses to excitation signals.

16. A package system comprising a package comprising:

a body,

an electrically supported by said body, and

an interface portion configured to receive a module to a removable attachment with said package;

wherein said electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement and a communications module according to claim 13.