MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT

• US 20150250063A1
• Filed: 05/15/2015
• Published: 09/03/2015
• Est. Priority Date: 10/13/2011
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Mohd Arshad, Mohamed Ashraf, Lim, Jin Keong
• Application Number:
  US14/713,062
• Publication Number:
  US 20150250063A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 5/02 Details

Abstract

A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.

Claims

1-13. -13. (canceled)

14. A molded system comprising:

a plurality of electronic components attached to a carrier, one of the components being an inductor of high thermal capacitance;

the surface of the inductor sealed with a hardened polymeric layer of high thermal resistance, the layer thermally insulating the inductor; and

molding compound encapsulating the carrier and the attached components including the inductor and the polymeric layer sealing the inductor'"'"'s surface.

15. The system of claim 14 wherein the molding compound touches the surface of the hardened polymeric layer.

16. The system of claim 15 wherein the carrier is a QFN/SON-type leadframe;

19. The system of claim 14 wherein the components attached to a carrier constitute a power supply.

20. The system of claim 14 wherein the inductor is able to act as a source of thermal energy.

21. The system of claim 14 wherein the inductor is able to act as a sink of thermal energy.

22. The system of claim 14 wherein the polymeric layer is a thermoset polymer.

23. The system of claim 14 wherein the molding compound touches the polymeric layer.

24. The system of claim 22 wherein the thermoset polymer has a thermal resistivity 100 to 500 times higher than metals.

25. The system of claim 22 wherein the polymeric layer covers the surface uniformly.

26. The system of claim 25 wherein the layer has a thickness of 0.5 mm or less.

27. The system of claim 22 wherein the molding compound is an epoxy-based thermoset polymer with a high percentage of inorganic fillers.

17. (canceled)

18. (canceled)