Embedded Circuit In A MEMS Device

• US 20150251898A1
• Filed: 03/23/2015
• Published: 09/10/2015
• Est. Priority Date: 02/01/2012
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Vos, Sandra F., Giesecke, Daniel
• Granted Patent: US 9,485,560 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.

Claims

1. A Microelectromechanical System (MEMS) microphone, comprising,

a base printed circuit board (PCB), the base PCB having customer pads;

at least one wall coupled to the base;

a lid PCB coupled to the at least wall, the lid having a port extending there through;

an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB;

an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via;

a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port such that sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit, the integrated circuit processing the signals and sending the processed signals to the customer pads via the electrically conductive through-hole via.

2. The MEMS microphone of claim 1, wherein integrated circuit comprises an application specific integrated circuit (ASIC).

3. The MEMS microphone of claim 1, wherein the MEMS device couples to the base via a lead wire.

4. The MEMS microphone of claim 1, wherein the MEMS device couples to the base via a solder connection.

5. A Microelectromechanical System (MEMS) microphone, comprising,

a base printed circuit board (PCB), the base PCB having customer pads;

a first integrated circuit embedded in the base;

a second integrated circuit not embedded in the base but disposed on the base and electrically coupled to the first integrated circuit;

a micro electro mechanical system (MEMS) device coupled to one or both of the first integrated circuit and the second integrated circuit;

such that sound energy is converted to an electrical signal by the MEMS device and transmitted to one or both of the first integrated circuit and the second integrated circuit for processing, the processed signal being made available at the customer pads on the base.

6. The MEMS microphone of claim 5, wherein first integrated circuit and the second integrated circuit comprise an application specific integrated circuits (ASICs).

7. The MEMS microphone of claim 5, wherein the MEMS device couples to the base via a lead wire.

8. The MEMS microphone of claim 5, wherein the MEMS device couples to the base via a solder connection.