PRE-PATTERNED HARD MASK FOR ULTRAFAST LITHOGRAPHIC IMAGING
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Abstract
A method of fabricating a substrate including coating a first resist onto a hardmask, exposing regions of the first resist to electromagnetic radiation at a dose of 10.0 mJ/cm2 or greater and removing a portion of said the and forming guiding features. The method also includes etching the hardmask to form isolating features in the hardmask, applying a second resist within the isolating features forming regions of the second resist in the hardmask, and exposing regions of the second resist to electromagnetic radiation having a dose of less than 10.0 mJ/cm2 and forming elements.
11 Citations
40 Claims
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1-20. -20. (canceled)
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21. An intermediate for use in a method of fabricating a substrate, comprising:
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a substrate; a hardmask layer on said substrate; and a cross grating formed on said hardmask layer, said cross grating comprising a first patterned layer and a second patterned layer; wherein; said first patterned layer is present on said hardmask layer; said second patterned layer is on said first patterned layer; and said first and second patterned layers intersect to form regions in which least a portion of said hardmask layer is exposed. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification