ELECTRIC VEHICLE INDUCTION COIL HOUSING WITH INTERENGAGEMENT STRUCTURE FOR FERRITE TILE ASSEMBLIES

• US 20150255205A1
• Filed: 03/10/2014
• Published: 09/10/2015
• Est. Priority Date: 03/10/2014
• Status: Active Grant

• Current Assignee: WiTricity Corporation
• Original Assignee: Qualcomm, Inc.
• Inventors: Islinger, Simon Peter
• Granted Patent: US 9,583,253 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B60L 53/122 Circuits or methods for driving the primary coil, e.g. supplying electric power to the coil
• CPC Class Codes: B60L 53/124 Detection or removal of foreign bodies
• CPC Class Codes: B60L 53/126 Methods for pairing a vehicle and a charging station, e.g. establishing a one-to-one relation between a wireless power transmitter and a wireless power receiver
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/005 Impregnating or encapsulating insulating of windings H01F41/12
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/90 involving detection or optimisation of position, e.g. alignment
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: Y02T 10/70 Energy storage systems for electromobility, e.g. batteries
• CPC Class Codes: Y02T 10/7072 Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
• CPC Class Codes: Y02T 90/14 Plug-in electric vehicles
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

Systems and methods for implementing interengagement structures for a ferrite tile assembly of an induction coil housing are described herein. One aspect of the subject matter described in the disclosure is a housing. The housing includes a base forming a receptacle. The housing further includes a ferrite tile assembly. The housing further includes an interengagement structure extending from the base and configured to secure the ferrite tile assembly relative to the base within the receptacle.

Claims

1. An induction coil housing comprising:

a base forming a receptacle; and

an interengagement structure extending from the base and configured to secure a ferrite tile assembly relative to the base within the receptacle.

2. The induction coil housing of claim 1, further comprising an epoxy, the epoxy being disposed in the receptacle.

3. The induction coil housing of claim 1, wherein the interengagement structure comprises a pillar configured to contact the ferrite tile assembly within an opening in the ferrite tile assembly.

4. The induction coil housing of claim 3, wherein the opening is disposed on a lower surface of the ferrite tile assembly.

5. The induction coil housing of claim 1, wherein the interengagement structure comprises a clip, the clip having a shaft extending from the base and a tang disposed on the end of the shaft.

6. The induction coil housing of claim 5, wherein the tang is configured to contact an upper surface of the ferrite tile assembly.

7. The induction coil housing of claim 6, wherein the clip is configured to contact a side surface of the ferrite tile assembly.

8. The induction coil housing of claim 7, wherein the interengagement structure further comprises a pillar configured to contact the ferrite tile assembly within an opening of the ferrite tile assembly.

9. The induction coil housing of claim 8, wherein at least one of the pillar and the tang is configured to support the ferrite tile assembly along a z axis.

10. The induction coil housing of claim 8, wherein the pillar extends from the base at a different location than where the clip extends from the base.

11. The induction coil housing of claim 1, wherein the interengagement structure is configured to secure the ferrite tile assembly by biasing with a degree of elasticity.

12. The induction coil housing of claim 1, wherein the ferrite tile assembly comprises multiple ferrite tiles.

13. A method for securing a ferrite tile assembly within a base of an induction coil housing, the method comprising:

providing a base forming a receptacle and having an interengagement structure, the interengagement structure extending from the base within the receptacle;

placing a ferrite tile assembly within the receptacle; and

contacting at least a portion of the ferrite tile assembly with the interengagement structure so as to inhibit movement of the ferrite tile assembly in at least one direction relative to the base.

14. The method of claim 13, wherein an epoxy is disposed within the receptacle.

15. An induction coil housing comprising:

a base forming a receptacle;

means for securing an upper surface of a ferrite tile assembly within the receptacle of the base;

means for securing a lower surface of the ferrite tile assembly within the receptacle of the base; and

means for securing a side surface of the ferrite tile assembly within the receptacle of the base.

16. The induction coil housing of claim 15, further comprising an epoxy, the epoxy being disposed in the receptacle.

17. The induction coil housing of claim 15, wherein the interengagement structure comprises a pillar and the ferrite tile assembly comprises an opening;

and locating at least a portion of the pillar in the opening.

18. The induction coil housing of claim 17, wherein the opening is on a lower surface of the ferrite tile assembly.

19. The induction coil housing of claim 18, wherein the interengagement structure comprises a clip, the clip having a shaft extending from the base and a tang disposed on the end of the shaft.

20. The induction coil housing of claim 19, wherein the tang is configured to contact an upper surface of the ferrite tile assembly.