SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor manufacturing equipment comprising:
- a support unit supporting a wafer;
a chamber accommodating the support unit therein;
a microwave generator generating a microwave;
a waveguide mounted on the chamber to irradiate the microwave to a front surface or a back surface of the wafer; and
an auxiliary heating unit heating the wafer by an electromagnetic wave with a wavelength shorter than a wavelength of the microwave.
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Abstract
A semiconductor manufacturing equipment according to an embodiment includes a support unit, a chamber, a microwave generator, a waveguide, and an auxiliary heating unit. The support unit supports a wafer. The chamber accommodates the support unit therein. The microwave generator generates a microwave. The waveguide is mounted on the chamber to irradiate the microwave to a surface of the wafer. The auxiliary heating unit heats the wafer by an electromagnetic wave with a wavelength shorter than a wavelength of the microwave.
20 Citations
20 Claims
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1. A semiconductor manufacturing equipment comprising:
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a support unit supporting a wafer; a chamber accommodating the support unit therein; a microwave generator generating a microwave; a waveguide mounted on the chamber to irradiate the microwave to a front surface or a back surface of the wafer; and an auxiliary heating unit heating the wafer by an electromagnetic wave with a wavelength shorter than a wavelength of the microwave. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A manufacturing method of a semiconductor device comprising:
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installing a wafer on a support unit in a chamber; and heating the wafer by irradiating a microwave from a waveguide mounted on the chamber to a front surface or a back surface of the wafer, the microwave is generated by a microwave generator, and irradiating an electromagnetic wave with a wavelength shorter than a wavelength of the microwave from an auxiliary heating unit to the wafer. - View Dependent Claims (17, 18, 19)
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20. A manufacturing method of a semiconductor device comprising:
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installing a wafer in a chamber; and irradiating an electromagnetic wave with a wavelength shorter than a wavelength of a microwave, the electromagnetic wave is generated by a first heating unit provided in the chamber, and then irradiating the microwave to a front surface of the wafer, the microwave is generated by a second heating unit.
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Specification