SUBSTRATE BAKING DEVICE AND TEMPERATURE ADJUSTING METHOD THEREOF

• US 20150255356A1
• Filed: 01/21/2014
• Published: 09/10/2015
• Est. Priority Date: 12/31/2013
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Yao, Jiangbo
• Application Number:
  US14/241,823
• Publication Number:
  US 20150255356A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

The present disclosure discloses a substrate baking device and a method for adjusting temperatures thereof. The substrate baking device comprises a baking device body having a hot plate composed of a plurality of subplates for baking a substrate, and a temperature adjusting mechanism for adjusting heating temperatures in the plurality of subplates of the baking device body. A heat conducting layer is arranged on the hot plate to cover the plurality of subplates. The substrate baking device is capable of improving film thickness uniformity.

Claims

1. A substrate baking device, comprising:

a baking device body having a hot plate composed of a plurality of subplates for baking a substrate, and

a temperature adjusting mechanism for adjusting heating temperatures of the plurality of subplates of the baking device body.

2. The substrate baking device according to claim 1, wherein a heat conducting layer is arranged on the hot plate to cover the plurality of subplates.

3. The substrate baking device according to claim 1, wherein the temperature adjusting mechanism includes:

a film thickness monitoring unit for detecting film thicknesses of a plurality of regions of the substrate corresponding to the plurality of subplates,

a data storage and calculating unit connected to the film thickness monitoring unit for receiving film thickness data transmitted by the film thickness monitoring unit and then calculating adjustment temperature values for the plurality of subplates, and

a temperature adjusting unit connected to the data storage and calculating unit and the baking device body for receiving data transmitted by the data storage and calculating unit, and then adjusting the temperatures of the plurality of subplates accordingly.

4. The substrate baking device according to claim 1, wherein the plurality of subplates each include a plate body and a heating member arranged below the plate body, all the heating members being connected to the temperature adjusting mechanism.

5. The substrate baking device according to claim 1, wherein the distance between the hot plate and the substrate can be adjusted.

6. The substrate baking device according to claim 5, wherein the distance between the hot plate and the substrate ranges from 5 to 20 mm.

7. A method for adjusting a temperature of a substrate baking device,

the substrate baking device comprising a baking device body having a hot plate composed of a plurality of subplates for baking a substrate, and a temperature adjusting mechanism for adjusting heating temperatures of the plurality of subplates of the baking device body, and

the method comprising the following steps:

detecting, after a first photolithography process, residual film thicknesses in a plurality of regions of the substrate through the temperature adjusting mechanism;

calculating corresponding temperature compensation values according to the relationship between residual film thickness and temperature; and

adjusting, through the temperature adjusting mechanism, the heating temperatures of the plurality of subplates of the baking device body according to the temperature compensation values.

8. The method according to claim 7, wherein the temperature adjusting mechanism includes a film thickness monitoring unit, a data storage and calculating unit, and a temperature adjusting unit,

the film thickness monitoring unit detects the residual film thicknesses of the plurality of regions of the substrate, and transmits the residual film thickness data detected to the data storage and calculating unit;

the data storage and calculating unit compares the residual film thicknesses with a stored reference value, calculates temperature compensation values according to the relationship between the stored film thickness and temperature, and transmits the temperature compensation values to the temperature adjusting unit; and

the temperature adjusting unit adjusts output powers of the plurality of subplates of the baking device body according to the corresponding temperature compensation values.

9. The method according to claim 8, wherein a proportional relationship exists between the residual film thickness and the temperature, and between the temperature and the power.

10. The method according to claim 8, wherein further comprising the following steps:

lowering the output power when the residual film thickness value is higher than the reference value, and

raising the output power when the residual film thickness value is lower than the reference value.

11. The method according to claim 9, wherein further comprising the following steps:

lowering the output power when the residual film thickness value is higher than the reference value, and

raising the output power when the residual film thickness value is lower than the reference value.

12. The method according to claim 7, wherein the method is used in a pre-baking procedure and/or a post-baking procedure in the photolithography process.

13. A method for adjusting heating temperatures of the substrate baking device,

the substrate baking device comprising a baking device body having a hot plate composed of a plurality of subplates for baking the substrate, and a temperature adjusting mechanism for adjusting the heating temperatures in the plurality of subplates of the baking device body, a heat conducting layer being arranged on the hot plate to cover the plurality of subplates,

the method comprising the following steps:

detecting, after a first photolithography process, residual film thicknesses in a plurality of regions of the substrate through the temperature adjusting mechanism;

calculating corresponding temperature compensation values according to the relationship between residual film thickness and temperature; and

adjusting, through the temperature adjusting mechanism, the heating temperatures of the plurality of subplates of the baking device body according to the temperature compensation values.

14. The method according to claim 13, wherein the temperature adjusting mechanism includes a film thickness monitoring unit, a data storage and calculating unit, and a temperature adjusting unit,

the film thickness monitoring unit detects the residual film thicknesses of the plurality of regions of the substrate, and transmits the residual film thickness data detected to the data storage and calculating unit;

the data storage and calculating unit compares the residual film thicknesses with a stored reference value, calculates temperature compensation values according to the relationship between the stored film thickness and temperature, and transmits the temperature compensation values to the temperature adjusting unit; and

the temperature adjusting unit adjusts output powers of the plurality of subplates of the baking device body according to the corresponding temperature compensation values.

15. The method according to claim 14, wherein a proportional relationship exists between the residual film thickness and the temperature, and between the temperature and the power.

16. The method according to claim 14, wherein further comprising the following steps:

lowering the output power when the residual film thickness value is higher than the reference value, and

raising the output power when the residual film thickness value is lower than the reference value.

17. The method according to claim 15, wherein further comprising the following steps:

lowering the output power when the residual film thickness value is higher than the reference value, and

raising the output power when the residual film thickness value is lower than the reference value.

18. The method according to claim 13, wherein the method is used in a pre-baking procedure and/or a post-baking procedure in the photolithography process.