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MEMS MOTION SENSOR AND METHOD OF MANUFACTURING

  • US 20150260519A1
  • Filed: 02/13/2015
  • Published: 09/17/2015
  • Est. Priority Date: 08/02/2013
  • Status: Active Grant
First Claim
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1. A MEMS motion sensor comprising:

  • an electrically conductive MEMS wafer having a first side and a second side[s] and including an outer frame, a proof mass and flexible springs suspending the proof mass relative to the outer frame and enabling the proof mass to move relative to the outer frame along mutually orthogonal x, y and z axes;

    an electrically conductive top cap wafer and an electrically conductive bottom cap wafer respectively bonded to the first side and the second side of the MEMS wafer such that the top cap wafer, the bottom cap wafer and the outer frame of the MEMS wafer define a cavity for housing the proof mass;

    a plurality of top cap wafer electrodes and a plurality of bottom cap wafer electrodes that are respectively positioned with the top cap wafer and the bottom cap wafer, the electrodes forming capacitors with the proof mass that are operative to detect a motion of the proof mass; and

    a first set of electrical contacts connected to the plurality of top cap wafer electrodes, and a second set of electrical contacts being conductively connected to the bottom cap wafer electrodes with insulated conducting pathways that extend upwardly through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

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