SENSOR EMBEDDED IN GLASS AND PROCESS FOR MAKING SAME
First Claim
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1. A cover assembly for an electronic device, comprising:
- a substrate comprising a first surface, a second surface opposing the first surface, and an opening in the first surface;
a sensor element comprising a first side and a second side opposing the first side, wherein the sensor element is embedded in the opening such that the first side of the sensor element is flush with the first surface of the substrate;
a gap between a perimeter of the opening in the substrate and a perimeter of the first side of the sensor element; and
a polymeric material disposed in the gap such that the polymeric material is flush with the first side of the sensor element and the first surface of the substrate.
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Abstract
A cover assembly for an electronic device includes a sensor element embedded in the opening of a substrate such that the first side of the sensor element is flush with the first surface of the substrate. This allows for conductive elements in the sensor element to be present at a surface of the cover assembly. The conductive elements are inside via holes. A sensor substrate with the via holes can be formed using a redraw process or a laser damage and etch process.
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Citations
24 Claims
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1. A cover assembly for an electronic device, comprising:
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a substrate comprising a first surface, a second surface opposing the first surface, and an opening in the first surface; a sensor element comprising a first side and a second side opposing the first side, wherein the sensor element is embedded in the opening such that the first side of the sensor element is flush with the first surface of the substrate; a gap between a perimeter of the opening in the substrate and a perimeter of the first side of the sensor element; and a polymeric material disposed in the gap such that the polymeric material is flush with the first side of the sensor element and the first surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A process for making a cover assembly for an electronic device, the process comprising:
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forming a sensor substrate having a first surface, an opposing second surface, and a plurality of via holes extending from the first surface to the second surface; filling the plurality of via holes with a conductive element; placing the sensor substrate into an opening extending from a first surface to an opposing second surface of a substrate such that there is a gap between a perimeter of the opening in the substrate and a perimeter of the first side of the sensor substrate, wherein the first surface of the sensor substrate is flush with the first surface of the substrate; and filling the gap with a polymeric material such that the polymeric material is flush with the first side of the sensor substrate and the first surface of the substrate. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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Specification