Isolation Rings for Packages and the Method of Forming the Same
First Claim
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1. A method comprising:
- bonding a first package component with a second package component;
encapsulating the second package component in a molding material;
forming a trench in the first package component, with the molding material exposed to the trench;
filling an isolation material into the trench to form an isolation region; and
sawing through the isolation region and the molding material to form a package.
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Abstract
A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
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Citations
20 Claims
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1. A method comprising:
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bonding a first package component with a second package component; encapsulating the second package component in a molding material; forming a trench in the first package component, with the molding material exposed to the trench; filling an isolation material into the trench to form an isolation region; and sawing through the isolation region and the molding material to form a package. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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bonding a plurality of dies onto a plurality of package substrates, wherein the plurality of package substrates is in a package substrate strip; encapsulating the plurality of dies with a molding compound; cutting the package substrate strip to form a plurality of trenches; filling the plurality of trenches with an isolation material; and sawing the isolation material to separate the package substrate strip and the plurality of dies into a plurality of packages. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method comprising:
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encapsulating a die with a molding compound, wherein the die is bonded to a first surface of a package substrate; grooving the package substrate from a second surface of the package substrate, with the first surface and the second surface being opposite to each other, wherein trenches formed by the grooving encircle a center portion of the package substrate, and wherein the trenches penetrate through the package substrate to reveal the molding compound; and filling the trenches with an isolation material. - View Dependent Claims (17, 18, 19, 20)
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Specification