METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
First Claim
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1. A test structure used to determine reliability performance, comprising:
- a patterned metallization structure having a plurality of interfaces, which provide stress risers;
a dielectric material surrounding the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design.
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Abstract
A test structure used to determine reliability performance includes a patterned metallization structure having multiple interfaces, which provide stress risers. A dielectric material surrounds the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design.
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Citations
11 Claims
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1. A test structure used to determine reliability performance, comprising:
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a patterned metallization structure having a plurality of interfaces, which provide stress risers; a dielectric material surrounding the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A test structure used to determine reliability performance, comprising:
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a patterned metallization structure having a plurality of interfaces, which provide stress risers; a dielectric material surrounding the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design; the test structure including at least one of;
a via chain formed through layers of the test structure such that a plurality of widths of vias are used to adjust strain in different layers, and a dummy structure configured to provide a via density in an area of the test structure to adjust strain in adjacent structures of the test structure. - View Dependent Claims (8, 9, 10, 11)
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Specification