LIGHT-EMITTING ARRAY

• US 20150263256A1
• Filed: 03/13/2015
• Published: 09/17/2015
• Est. Priority Date: 03/14/2014
• Status: Abandoned Application

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Hsieh, Min-Hsun, Chen, Chao-Hsing, Yeh, Jui-Hung, Hsu, Chia-Liang, He, Guan-Ru
• Application Number:
  US14/657,714
• Publication Number:
  US 20150263256A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/3512 Cracking
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.

Claims

1. An light-emitting array, comprising:

a first light-emitting chip;

a second light-emitting chip; and

a conductive line electrically connecting to the first light-emitting chip and the second light-emitting chip,

wherein the conductive line comprises a first segment and a second segment having a radius curvature different from that of the first portion.

2. The light-emitting array of claim 1, wherein the first light-emitting chip comprises a first pad, two second pads, a rectangular shape and four corners.

3. The light-emitting array of claim 2, wherein two of the corners are located in a diagonal line, and the two second pads are formed on the diagonal corners.

4. The light-emitting array of claim 3, wherein the first pad extends between two of the corners and in a direction passing through the diagonal line.

5. The light-emitting array of claim 1, wherein the conductive line comprises a first portion connecting on the second light-emitting chip and a second portion connecting the first portion, and the first portion has a width more large than the second portion has.

6. The light-emitting array of claim 1, wherein the conductive line comprises a stretchable segments having a width W, and a first vertex and a vertex arranged in a distance L, and a ratio between the width W and the distance L is between 0.1˜

0.4.

7. The light-emitting array of claim 1, further comprising:

a first conductive line connecting to a first pad of the first light-emitting chip; and

a second conductive line connecting to a second pad of the first light-emitting chip, wherein an area of the first conductive line connecting to the first pad is larger than that of the second conductive line connecting to the second pad.

8. The light-emitting array of claim 1, wherein the conductive line comprises a connection portion not directly connecting to the first light-emitting chip, and a ratio between a width of the connection portion and a width of the first light-emitting chip is between 2 to 10.