CIRCUIT MOUNTING APPARATUS AND METHOD USING A SEGMENTED LEAD-FRAME

• US 20150268261A1
• Filed: 03/18/2014
• Published: 09/24/2015
• Est. Priority Date: 03/18/2014
• Status: Abandoned Application

• Current Assignee: TRW Automotive USLLC (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Original Assignee: TRW Automotive USLLC (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Murray, Neil Gordon Jr., Ramsay, Mark
• Application Number:
  US14/217,874
• Publication Number:
  US 20150268261A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01L 19/0092 Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/02 by making use of inertia forces using solid seismic massesG01P15/14 takes precedence
• CPC Class Codes: H01L 21/4825 Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members

Abstract

A circuit mounting assembly having a segmented lead frame, and an integrated circuit mounted on the segmented lead frame. The segmented lead frame has a main body portion with at least one severable slot and a plurality of connectors extending from the main body portion. Electrical communication between the plurality of connectors and the integrated circuit is controlled by severance of the at least one slot.

Claims

1. A circuit mounting assembly comprising:

a segmented lead frame; and

an integrated circuit mounted on the segmented lead frame;

said segmented lead frame having a main body portion with at least one severable slot and a plurality of connectors extending from the main body portion, electrical communication between the plurality of connectors and the integrated circuit being controlled by severance of said at least one slot.

2. The circuit mounting assembly of claim 1 further comprising:

a first insert molded soft inner layer of material partially covering the segmented lead frame and covering the integrated circuit; and

a second overmolded hard outer layer of material covering the first soft inner layer of material and bonded thereto and rigidly contacting the segmented lead frame.

3. The circuit mounting assembly of claim 1 wherein said integrated circuit is an application specific integrated circuit.

4. The circuit mounting assembly of claim 3 wherein said integrated circuit includes sensors for sensing a vehicle crash event.

5. A method for assembling a circuit comprising the steps of:

mounting an integrated circuit to a segmented lead frame having at least one severable slot and a plurality of connectors;

securing the integrated circuit to the segmented lead frame; and

severing the at least one severable slot so as to provide a desired electrical connection between the connectors and the integrated circuit.

6. The method of claim 5 further comprising the steps of:

insert molding a soft inner layer of material over a portion of the segmented lead frame and covering the integrated circuit; and

overmolding a hard outer layer of material over the first soft inner layer of material and contacting the segmented lead frame.