DUAL-INTERFACE HYBRID METAL SMARTCARD WITH A BOOSTER ANTENNA OR COUPLING FRAME

• US 20150269477A1
• Filed: 03/18/2015
• Published: 09/24/2015
• Est. Priority Date: 08/30/2012
• Status: Abandoned Application

• Current Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren, Ummenhofer, Klaus
• Application Number:
  US14/660,941
• Publication Number:
  US 20150269477A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A dual-interface metal hybrid smartcard comprising a plastic card body (CB); a metal slug (MS) disposed in the card body; and a booster antenna (BA) disposed in the card body. The metal slug may have a surface area which is at least 50% of a surface area of the card body, and may comprise titanium or alloys thereof. A antenna chip module (AM) having an antenna (MA) and contact pads (CP) may be disposed in an opening of the card body. The metal slug may comprise two or more separate metal slug components (MS-1, MS-2), which may overlap one another or which may be disposed at different locations in the card body (CB), without overlapping one another. The first metal slug component (MS-1) may be disposed around a peripheral portion of the card body (CB) as an “open loop” discontinuous metal frame around (external to) the booster antenna (BA). The second metal slug component (MS-2) may be disposed internal to the card antenna (CA) component of the booster antenna (BA).

Claims

1. A dual-interface metal hybrid smartcard comprising:

a plastic card body (CB);

a metal slug (MS) disposed in the card body; and

a booster antenna (BA) disposed in the card body comprising a card antenna (CA) component disposed around a peripheral area of the card body, a coupler coil (CC) component disposed at an interior area of the card body around an opening (OP) for receiving an antenna module (AM) or transponder chip module (TCM), and optionally an extension antenna (EA) component extending across another interior area of the card body.

2. The dual-interface metal hybrid smartcard of claim 1, wherein:

the metal slug has a surface area which is at least 50% of a surface area of the card body.

3. The dual-interface metal hybrid smartcard of claim 1, wherein:

the metal slug comprises titanium or alloys thereof.

4. The dual-interface metal hybrid smartcard of claim 1, further comprising:

an antenna module (AM) disposed in the opening in the card body;

wherein the antenna module comprises an RFID chip (IC, CM) and a module antenna (MA) which may be a planar antenna (PA) for implementing a contactless interface with an external contactless reader.

5. The dual-interface metal hybrid smartcard of claim 4, wherein the antenna module further comprises:

ISO contact pads (CP) for implementing a contact interface with an external contact reader.

6. The dual-interface metal hybrid smartcard of claim 1, wherein:

the booster antenna occupies a first portion of the card body and the metal slug occupies a second portion of the card body which is separate from the first portion of the card body, the metal slug being formed in such a way as to allow for the insertion or placement of the booster antenna (BA) and its components into or onto the card body.

7. The dual-interface metal hybrid smartcard of claim 1, wherein:

the booster antenna is formed on an antenna substrate (AS) which is separate from the card body (CB) with metal slug (MS), and is later joined thereto.

8. The dual-interface metal hybrid smartcard of claim 1, wherein:

the metal slug is formed in a manner to allow for non-shielding of the electromagnetic field around areas of the coupler coil (CC) and its various components.

9. The dual-interface metal hybrid smartcard of claim 1, wherein:

the metal slug comprises two separate metal slug components (MS-1, MS-2); and

a first (MS-1) of the components is disposed at a first location in the card body;

a second (MS-2) of the components is disposed at a second location in the card body; and

the two components do not overlap one another.

10. The dual-interface metal hybrid smartcard of claim 9, wherein:

the first metal slug component is disposed at an upper portion of the card body; and

the second metal slug component is disposed at a lower portion of the card body.

11. The dual-interface metal hybrid smartcard of claim 9, wherein:

the first metal slug component (MS-1) is disposed around a perimeter of the card body; and

the second metal slug component (MS-2) is disposed at an interior location of the card body.

12. The dual-interface metal hybrid smartcard of claim 11, wherein:

the first metal slug component (MS-1) is disposed external to the card antenna (CA) component of the booster antenna (BA), and is not behind the card antenna component; and

the second metal slug component (MS-2) is disposed internal to the card antenna (CA) component of the booster antenna (BA).

13. The dual-interface metal hybrid smartcard of claim 11, wherein:

the first metal slug component (MS-1) is in the form of a “

closed loop”

continuous metal frame around the perimeter of the card body, and is not behind the card antenna component.

14. The dual-interface metal hybrid smartcard of claim 11, wherein:

the first metal slug component (MS-1) is in the form of an “

open loop”

discontinuous metal frame around the perimeter of the card body, and is not behind the card antenna component.

15. A dual-interface metal hybrid smartcard comprising:

a card body (CB);

an “

open loop”

metal frame (DMF) disposed around a peripheral area of the card body and having a slit (S) extending from an inner edge to an outer edge of the metal frame; and

a booster antenna (BA) disposed inside the an internal area of the metal frame.

16. The dual-interface metal hybrid smartcard of claim 15, wherein:

the “

open loop”

metal frame comprises a slit (S) extending from an inner edge of the metal frame to an outer edge of the metal frame; and

further comprising;

an insulating layer disposed on at least one side of the metal frame, covering the slit.

17. A metal slug for a hybrid metal/plastic card body, wherein the metal slug is generally rectangular having a body portion which is smaller than the periphery of the card body and having at least one corner portion extending as a protrusion to corresponding at least one corner of the card body.

18. The metal slug of claim 17 having four corner portions extending as protrusions to respective four corners of the card body.

19. The metal slug of claim 17 further comprising:

an opening (WO) for accepting transponder chip module (TCM); and

a slit (S) extending from the opening to a peripheral edge of the metal slug.

20. The metal slug of claim 19, wherein:

the slit is filled or covered with a dielectric or oxide layer or with a layer of plastic on at least one side thereof.