HEAVILY PHOSPHOR LOADED LED PACKAGES HAVING HIGHER STABILITY

• US 20150270451A1
• Filed: 03/18/2014
• Published: 09/24/2015
• Est. Priority Date: 03/18/2014
• Status: Active Grant

• Current Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: CHOWDHURY, Ashfaqul Islam, ALLEN, Gary Robert, CAI, Dengke
• Granted Patent: US 9,680,067 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C09K 11/617 Silicates
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/0025 comprising only AIIIBV compounds
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y02B 20/00 Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Abstract

Heavily phosphor loaded LED packages having higher stability and a method for increasing the stability of heavily phosphor loaded LED packages. A silicone overlayer is provided on the phosphor silicone blend layer.

Claims

1. A heavily phosphor loaded LED package having higher stability, comprising:

an LED;

a heavily loaded phosphor silicone blend layer overlaying the LED; and

a silicone overlayer.

2. The LED package of claim 1, wherein the phosphor silicone blend is at least 20% phosphor.

3. The LED package of claim 1, wherein a phosphor in the phosphor silicone blend exhibits sensitivity to ambient atmospheric constituents such as moisture.

4. The LED package of claim 1, wherein the phosphor silicon blend includes PFS phosphor and BSY phosphor or a spectrally similar phosphor.

5. The LED package of claim 1, wherein the LED package is a low to mid power LED package that uses a BSY-PFS phosphor.

6. The LED package of claim 1, wherein the silicone overlayer has a thickness of about 0.1 mm or greater.

7. The LED package of claim 6, wherein the phosphor silicone blend layer has a thickness of about 0.2 mm.

8. The LED package of claim 6, wherein the silicone overlayer has a thickness between about 0.1 mm and 0.5 mm.

9. The LED package of claim 1 wherein the silicone overlayer is made of the same silicone as in the phosphor silicone blend.

10. The LED package of claim 1, wherein the package has at least a 25% improvement in color shift compared to the same package without a silicone overlayer.

11. (canceled)

12. (canceled)

13. (canceled)

14. (canceled)

15. (canceled)

16. (canceled)

17. (canceled)

18. (canceled)

19. (canceled)

20. (canceled)

21. A phosphor-loaded LED package comprising:

an LED;

a first layer comprising a blend of phosphor and silicone overlaying the LED, wherein the blend comprises a phosphor to silicone weight ratio of at least 20%; and

an overlayer comprising silicone.

22. The LED package of claim 21, wherein the overlayer does not comprise phosphor.

23. The LED package of claim 21, wherein a phosphor in the blend exhibits moisture sensitivity.

24. The LED package of claim 21, wherein the blend includes a red phosphor and yellow phosphor.

25. The LED package of claim 21, wherein the blend comprises PFS phosphor.

26. The LED package of claim 21, wherein the blend comprises YAG phosphor.

27. The LED package of claim 21, wherein the LED package uses a BSY-PFS phosphor.

28. The LED package of claim 21, wherein the LED package is a low to mid power LED package that is <

1 W.

29. The LED package of claim 21, wherein the overlayer has a thickness of about 0.1 mm or greater.

30. The LED package of claim 21, wherein the overlayer is made of the same silicone as in the blend of the first layer.