OPTOELECTRONIC SEMICONDUCTOR COMPONENT
First Claim
1. An optoelectronic semiconductor component, comprising a carrier element, on which an optoelectronic semiconductor chip having at least one active layer is arranged, wherein the active layer is designed to emit or to receive light during operation and wherein the semiconductor chip is covered with a protective layer comprising parylene.
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Accused Products
Abstract
The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
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Citations
18 Claims
- 1. An optoelectronic semiconductor component, comprising a carrier element, on which an optoelectronic semiconductor chip having at least one active layer is arranged, wherein the active layer is designed to emit or to receive light during operation and wherein the semiconductor chip is covered with a protective layer comprising parylene.
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18. An optoelectronic semiconductor component, comprising a carrier element, on which an optoelectronic semiconductor chip having at least one active layer is arranged, wherein the active layer is designed to emit or to receive light during operation and wherein the semiconductor chip is covered with a protective layer comprising parylene, wherein the carrier element has a mounting surface facing away from the optoelectronic semiconductor chip, the semiconductor chip is laterally surrounded by a potting material, and the protective layer covers all surfaces of the semiconductor component apart from the mounting surface and forms an outer layer of the semiconductor component, and wherein the carrier element has at least two electrical connection elements which are embodied as plated-through holes and which extend from the mounting surface facing away from the semiconductor chip through the carrier element as far as that side of the carrier element which faces the semiconductor chip.
Specification