Semiconductor Device
2 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.
24 Citations
31 Claims
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1-15. -15. (canceled)
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16. A semiconductor device comprising:
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a semiconductor component; a carrier body on which the semiconductor component is mounted, the carrier body comprising a ceramic body and a thermistor sensor structure directly connected to the ceramic body, the thermistor sensor structure being integrated into the carrier body; and a heat sink, wherein the carrier body is mounted on the heat sink. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification