CAP MODULE FOR MICRO ELECTRO MECHANICAL SYSTEM AND MICRO ELECTRO MECHANICAL SYSTEM SENSOR HAVING THE SAME

• US 20150274510A1
• Filed: 04/30/2014
• Published: 10/01/2015
• Est. Priority Date: 11/29/2013
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Jae Chang, KIM, Jong Woon, SONG, Jong Hyeong, LEE, Hyun Kee
• Application Number:
  US14/265,760
• Publication Number:
  US 20150274510A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/31511 Of epoxy ether

Abstract

Embodiments of the invention provide a cap module for MEMS including a substrate, a first negative photoresist, which is formed on one surface of the substrate, and a second negative photoresist, which is formed on one surface of the first negative photoresist.

Claims

1. A cap module for MEMS, comprising:

a substrate;

a first negative photoresist which is formed on one surface of the substrate; and

a second negative photoresist which is formed on one surface of the first negative photoresist.

2. The cap module for MEMS as set forth in claim 1, wherein the first negative photoresist and the second negative photoresist are each formed so that space parts formed with cavities correspond to each other.

3. The cap module for MEMS as set forth in claim 2, wherein the space part is formed by applying the same mask to the first negative photoresist and the second negative photoresist and exposing and developing the first negative photoresist and the second negative photoresist.

4. The cap module for MEMS as set forth in claim 1, wherein the first negative photoresist and the second negative photoresist are formed by spin coating and are formed to have a thickness by controlling an RPM.

5. The cap module for MEMS as set forth in claim 1, wherein the first negative photoresist is SU-8, which is an epoxy-based negative photoresist.

6. The cap module for MEMS as set forth in claim 1, wherein the second negative photoresist is liquid SINR.

7. A MEMS sensor, comprising:

a sensor part; and

a cap module, which is coupled with the sensor part to cover the sensor part,

wherein the cap module comprises a substrate, a first negative photoresist formed on one surface of the substrate, and a second negative photoresist formed on one surface of the first negative photoresist.

8. The MEMS sensor as set forth in claim 7, wherein the sensor part covered with the cap module comprises:

a mass part;

a flexible substrate, which is displaceably coupled with the mass part; and

a support part, which is coupled with the flexible substrate and floatably supports the mass part.

9. The MEMS sensor as set forth in claim 7, wherein the cap module covers the flexible substrate and comprises an upper cap, which is coupled with the flexible substrate and a lower cap, which covers the mass part and is coupled with the support part.

10. The MEMS sensor as set forth in claim 9, wherein the second negative photoresist of the upper cap is coupled with the flexible substrate and the second negative photoresist of the lower cap is supported with the support part.

11. The MEMS sensor as set forth in claim 7, wherein the first negative photoresist and the second negative photoresist are each formed to face each other in the sensor part so that space parts formed with cavities are formed to correspond to each other.

12. The MEMS sensor as set forth in claim 11, wherein the space part is formed by applying the same mask to the first negative photoresist and the second negative photoresist and exposing and developing the first negative photoresist and the second negative photoresist.

13. The MEMS sensor as set forth in claim 7, wherein the first negative photoresist and the second negative photoresist are formed by spin coating and are formed to have a thickness by controlling an RPM.

14. The MEMS sensor as set forth in claim 7, wherein the first negative photoresist is SU-8, which is an epoxy-based negative photoresist.

15. The MEMS sensor as set forth in claim 7, wherein the second negative photoresist is liquid SINR.

16. The MEMS sensor as set forth in claim 8, wherein the sensor part is further provided with a frame which is selectively connected to the flexible substrate, the support part, and the mass part and limits a displacement of the mass part or is displaceably supported to the support part.