MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITIES AND METHODS FOR THE FABRICATION THEREOF
First Claim
1. A method for fabricating a microelectronic package, comprising:
- bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer; and
bonding a second MEMS die having a second MEMS transducer structure thereon to one of the cap piece and the second MEMS die such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity.
17 Assignments
0 Petitions
Accused Products
Abstract
Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.
12 Citations
20 Claims
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1. A method for fabricating a microelectronic package, comprising:
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bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer; and bonding a second MEMS die having a second MEMS transducer structure thereon to one of the cap piece and the second MEMS die such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for fabricating microelectronic packages, comprising:
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bonding a first wafer to a second wafer to produce a two wafer stack comprising a first array of Microelectromechanical Systems (MEMS) transducer structures enclosed by a first plurality of hermetic cavities each containing a first predetermined pressure; bonding a third wafer to the two wafer stack to produce a three wafer stack comprising a second array of MEMS transducer structures enclosed by a second plurality of hermetic cavities each containing a second predetermined pressure different than the first predetermined pressure; and singulating the three wafer stack into a plurality of die-cap stacks each including axially-partitioned hermetic cavities enclosing different MEMS transducer structures and containing different internal pressures. - View Dependent Claims (14, 15, 16)
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17. A microelectronic package, comprising:
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a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure formed thereon; a second MEMS die having a second MEMS transducer structure formed thereon; a cap piece stacked with the first and second MEMS die; a first hermetically-sealed cavity enclosing the first MEMS transducer structure and containing a first predetermined pressure; and a second hermetically-sealed cavity enclosing the second MEMS transducer structure and containing a second predetermined pressure different than the first predetermined pressure. - View Dependent Claims (18, 19, 20)
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Specification