TERAHERTZ RADIATION DETECTOR, FOCAL PLANE ARRAY INCORPORATING TERAHERTZ DETECTOR, MULTISPECTRAL METAMATERIAL ABSORBER, AND COMBINED OPTICAL FILTER AND TERAHERTZ ABSORBER

• US 20150276489A1
• Filed: 05/27/2015
• Published: 10/01/2015
• Est. Priority Date: 11/27/2012
• Status: Active Grant

• Current Assignee: University Court of the University of Glasgow (University of Glasgow)
• Original Assignee: University Court of the University of Glasgow (University of Glasgow)
• Inventors: Cumming, David Robert Sime, Grant, James Paul, McCrindle, Iain James Hugh
• Granted Patent: US 9,513,171 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 2005/202 Arrays
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/0803 Arrangements for time-dependent attenuation of radiation signals
• CPC Class Codes: G01J 5/0853 having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
• CPC Class Codes: G01J 5/0881 Compact construction
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/58 using absorption; using extinction effect
• CPC Class Codes: G02B 1/002 made of materials engineered to provide properties not available in nature, e.g. metamaterials
• CPC Class Codes: G02B 5/008 Surface plasmon devices diffractive gratings with a pitch less than or comparable to the wavelength G02B5/1809; surface plasmons in integrated optics G02B6/1226; optical analysis of materials by means of surface plasmons G01N21/553
• CPC Class Codes: G02B 5/22 Absorbing filters G02B5/201 - G02B5/208 take precedence

Abstract

The invention provides a detector comprising a metamaterial absorber and a micro-bolometer arranged to detect terahertz (THz) radiation. The metamaterial absorber can absorb multiple frequency bands, from the infrared and the THz regions of the electromagnetic spectrum. The detector is scalable to be suitable for use in a focal plane array.

The invention also provides a hybrid of a plasmonic filter, e.g. for optical radiation, and a metamaterial absorber for terahertz (and/or infrared) radiation, to create a single material capable of absorbing narrow band terahertz radiation and filtering radiation in another part of the spectrum, e.g. optical radiation. Such material has great potential in future imaging technology where hybridisation can maximise the spectral information density of an optical system.

Claims

1. A focal plane array imaging system comprising a plurality of pixel sensors arranged in a periodic array on a common substrate, wherein each pixel sensor in the plurality of pixel sensors comprises:

a resonant metamaterial absorber, and

a micro-bolometer sensor mounted on the metamaterial absorber, and

wherein adjacent pixel sensors in the plurality of pixel sensors are separated by thermal isolation regions.

2. The focal plane array imaging system according to claim 1, wherein the metamaterial absorber of each pixel sensor has a symmetrical shape adapted to ensure the pixel sensor is polarization insensitive.

3. The focal plane array imaging system according to claim 1, wherein the metamaterial absorber of each pixel sensor has an asymmetrical shape adapted to ensure the pixel sensor is polarization sensitive.

4. The focal plane array imaging system according to claim 1, wherein the resonant metamaterial absorber of each pixel sensor comprises an electric ring resonator (ERR) structure.

5. The focal plane array imaging system according to claim 4, wherein the electric ring resonator structure is cross-shaped.

6. The focal plane array imaging system according to claim 1, wherein the resonant metamaterial absorber of each pixel sensor comprises an electrically conductive ground layer, a layer of dielectric material on the ground layer, and an electrically conductive active layer separated from the ground layer by the dielectric material, wherein the active layer has a resonant geometry selected to couple electric field components of an incident THz radiation wave.

7. The focal plane array imaging system according to claim 6, wherein the resonant metamaterial absorber of each pixel sensor further comprises:

a second electrically conductive active layer mounted in the dielectric material between the electrically conductive active layer and the electrically conductive ground layer,

wherein the second electrically conductive active layer comprises a plurality of resonant structures arranged to couple to the electric field of an incident infrared (IR) radiation wave.

8. The focal plane array imaging system according to claim 6, wherein absorption characteristics of the resonant metamaterial absorber is controlled through selection of any one or more of:

(i) geometry of the active layer,

(ii) the thickness of the dielectric layer,

(iii) dielectric properties of the dielectric layer,

(iv) period of the pixel sensors in the array.

9. The focal plane array imaging system according to claim 1, wherein the plurality of pixel sensors provides a plurality of resonant geometries to permit dual band or broadband absorption across the THz radiation frequency range.

10. The focal plane array imaging system according to claim 1, wherein the plurality of pixel sensors is arrayed with a period in the range 2 to 150 μ

m.

11. The focal plane array imaging system according to claim 6, wherein the micro-bolometer sensor comprises a heat sensitive element mounted in thermal communication with the active layer of the resonant metamaterial absorber.

12. The focal plane array imaging system according to claim 11 having an electrically insulating layer between the heat sensitive element and the active layer.

13. The focal plane array imaging system according to claim 12, wherein the thermal isolation regions between adjacent pixel sensors comprise physical gaps between the electrically insulating layer, the dielectric layer and the ground layer of adjacent pixel sensors.

14. A detector comprising:

a resonant metamaterial absorber, and

a micro-bolometer sensor mounted on the metamaterial absorber,

wherein the metamaterial absorber comprises an electrically conductive active layer mounted on a first surface of a dielectric material, an electrically conductive ground layer mounted on a second surface of a dielectric material opposite the first surface, and

wherein the electrically conductive active layer has a resonant geometry arranged to couple to the electric field of an incident THz radiation or infrared (IR) wave.

15. A device comprising:

a metamaterial absorber comprising;

a layer dielectric material;

a first electrically conductive active layer mounted on a first surface of the dielectric material,

an electrically conductive ground layer mounted on a second surface of the dielectric material opposite the first surface, and

a second electrically conductive active layer mounted in the dielectric material between the electrically conductive active layer and the electrically conductive ground layer,

wherein the first electrically conductive active layer has a resonant geometry arranged to couple to the electric field of an incident THz radiation wave, and

wherein the second electrically conductive active layer comprises a plurality of resonant structures arranged to couple to the electric field of an incident infrared (IR) radiation wave.

16. The device according to claim 15 further comprising:

a micro-bolometer sensor mounted on the metamaterial absorber.

17. A combined plasmonic filter and THz radiation absorber device comprising a resonant metamaterial absorber having an electrically conductive ground layer, an electrically conductive active layer having a resonant geometry, and a dielectric material separating the ground layer from the active layer, the device includes a surface plasmon supporting layer patterned with a periodic array of surface discontinuities to function as a plasmonic filter.

18. The combined plasmonic filter and THz radiation absorber device according to claim 17, wherein the plasmonic filter is adapted to transmit a predetermined band of radiation, and wherein the active layer and dielectric material are arranged to transmit the predetermined band of radiation.

19. The combined plasmonic filter and THz radiation absorber device according to claim 18, wherein the active layer include gaps therein for transmitting the predetermined band of radiation.

20. The combined plasmonic filter and THz radiation absorber device according to claim 18, wherein the predetermined band of radiation is optical radiation, and the dielectric material is transparent.

21. The combined plasmonic filter and THz radiation absorber device according to claim 17, wherein the surface plasmon supporting layer is the active layer or the ground layer.

22. A multispectral device for filtering optical radiation and absorbing THz radiation, the device comprising a plurality of filter/absorber hybrid cells mounted in a periodic array, each filter/absorber hybrid cell comprising:

a resonant metamaterial absorber having an electrically conductive ground layer, an electrically conductive active layer having a resonant geometry, and a dielectric material separating the ground layer from the active layer, and

a surface plasmon supporting layer patterned with a periodic array of surface discontinuities to function as a plasmonic filter.

23. The multispectral device according to claim 22, wherein the active layer and dielectric material are adapted to transmit optical radiation, and the ground layer is patterned with a periodic array of surface discontinuities to form the surface plasmon supporting layer for the transmitted optical radiation.

24. The multispectral device according to claim 22, wherein the plurality of hybrid cells is fabricated on a common ground layer.

25. The multispectral device according to claim 22, wherein the surface discontinuities comprise a triangular array of nanoholes formed in the ground layer.

26. The multispectral device according to claim 22, wherein the dielectric material is transparent to optical radiation.

27. The multispectral device according to claim 22 wherein the active layer is in the form of a hollowed out cross.

28. The multispectral device according to claim 22, wherein the surface plasmon supporting layer comprises an array of optical filter regions, each optical filter region being associated with a respective different period or diameter of holes fabricated on the surface plasmon supporting layer, wherein each optical filter region is sensitive to a different optical wavelength.