BARRIER LAYER FOR DIELECTRIC LAYERS IN SEMICONDUCTOR DEVICES
First Claim
1. A method of forming a semiconductor device, the method comprising:
- forming an interfacial layer;
forming a dielectric layer over the interfacial layer;
forming a conductive layer over the dielectric layer; and
treating, after the forming the conductive layer, the conductive layer to increase an oxygen-blocking ability of the conductive layer.
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Abstract
A semiconductor device having a high-k gate dielectric, and a method of manufacture, is provided. A gate dielectric layer is formed over a substrate. An interfacial layer may be interposed between the gate dielectric layer and the substrate. A barrier layer, such as a TiN layer, having a higher concentration of nitrogen along an interface between the barrier layer and the gate dielectric layer is formed. The barrier layer may be formed by depositing, for example, a TiN layer and performing a nitridation process on the TiN layer to increase the concentration of nitrogen along an interface between the barrier layer and the gate dielectric layer. A gate electrode is formed over the barrier layer.
13 Citations
20 Claims
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1. A method of forming a semiconductor device, the method comprising:
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forming an interfacial layer; forming a dielectric layer over the interfacial layer; forming a conductive layer over the dielectric layer; and treating, after the forming the conductive layer, the conductive layer to increase an oxygen-blocking ability of the conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a semiconductor device, the method comprising:
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providing a substrate; forming a gate dielectric layer over the substrate; forming a barrier layer over the gate dielectric layer; and increasing a nitrogen concentration in the barrier layer along an interface between the barrier layer and the gate dielectric layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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a substrate; a gate dielectric layer over the substrate; a conductive layer over the gate dielectric layer; and a gate electrode over the conductive layer, the conductive layer having a higher relative nitrogen concentration along an interface between the gate dielectric and the conductive layer than at a first location away from the interface between the gate dielectric and the conductive layer. - View Dependent Claims (19, 20)
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Specification