Battery, Integrated Circuit and Method of Manufacturing a Battery

• US 20150280287A1
• Filed: 03/31/2014
• Published: 10/01/2015
• Est. Priority Date: 03/31/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Joshi, Ravi Keshav, Breymesser, Alexander, Goller, Bernhard, Karlovsky, Kamil, Santos Rodriguez, Francisco Javier, Zorn, Peter
• Granted Patent: US 10,749,216 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0585 of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 10/4257 Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 50/11 having a chip structure, e.g. micro-sized batteries integrated on chips
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49108 Electric battery cell making

Abstract

A battery includes a first substrate having a first main surface, a second substrate made of a conducting material or semiconductor material, and a carrier of an insulating material. The carrier has a first and a second main surfaces, the second substrate being attached to the first main surface of the carrier. An opening is formed in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate. The second main surface of the carrier is attached to the first substrate, thereby forming a cavity. The battery further includes an electrolyte disposed in the cavity.

Claims

1. A battery, comprising:

a first substrate having a first main surface;

a second substrate made of a conducting material or a semiconductor material;

a carrier of an insulating material, having first and second main surfaces, the second substrate being attached to the carrier;

an opening in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate, the second main surface of the carrier being attached to the first substrate, thereby forming a cavity; and

an electrolyte disposed in the cavity.

2. The battery according to claim 1, wherein the battery is a lithium ion battery having an anode comprising a component made of silicon.

3. The battery according to claim 2, wherein the anode of the battery is formed at the first substrate, and a cathode of the battery is formed at the second substrate.

4. The battery according to claim 2, wherein the anode of the battery is formed at the second substrate, and a cathode of the battery is formed at the first substrate.

5. The battery according to claim 1, wherein the second substrate is embedded into the carrier.

6. The battery according to claim 5, wherein the second substrate includes a patterned structure.

7. The battery according to claim 1, further comprising a liquid electrolyte.

8. An integrated circuit including a battery comprising:

a first substrate having a first main surface;

a second substrate made of a conducting or semiconductor material;

a carrier of an insulating material, having a first and a second main surfaces, the second substrate being attached to the carrier;

an opening in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate, the second main surface of the carrier being attached to the first main surface of the first substrate, thereby forming a cavity; and

an electrolyte disposed in the cavity.

9. The integrated circuit according to claim 8, further comprising circuit elements in the first substrate.

10. The integrated circuit according to claim 8, further comprising circuit elements in the second substrate.

11. A method of manufacturing a battery, the method comprising:

forming a cavity in a stack including a first substrate, a carrier of an insulating material, and a second substrate made of a conductive or a semiconductor material;

attaching a second main surface of the second substrate to a first main surface of the carrier;

forming an opening in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate;

attaching a first main surface of the first substrate to a second main surface of the carrier; and

filling an electrolyte in the cavity.

12. The method according to claim 11, further comprising patterning the second surface of the second substrate to have a protruding portion before attaching the second substrate to the carrier.

13. The method according to claim 12, wherein the second substrate is attached to the carrier using hot embossing.

14. The method according to claim 11, further comprising forming a protective conductive layer over the uncovered portion of the second main surface of the second substrate.

15. The method according to claim 11, further comprising forming an anode of the battery at the first surface of the first substrate.

16. The method according to claim 11, further comprising forming an anode of the battery at the second main surface of the second substrate.

17. The method according to claim 12, wherein the second substrate is attached to the carrier using anodic bonding.

18. The method according to claim 11, further comprising patterning the second main surface of the second substrate to form a plurality of grooves in the second main surface before attaching the second substrate to the carrier.

19. The method according to claim 18, wherein a surface of the grooves is uncovered after forming the opening in the second main surface.

20. The method according to claim 11, further comprising removing a portion of the second substrate to uncover a portion of the first main surface of the carrier.