SOLID STATE LIGHTING APPARATUSES, SYSTEMS, AND RELATED METHODS

• US 20150282260A1
• Filed: 03/05/2015
• Published: 10/01/2015
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Johnson, Jeremy Allen, Hardin, Craig William
• Granted Patent: US 9,538,590 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21S 8/02 of recess-mounted type, e.g. downlighters specially adapted for vehicle exteriors F21S41/00-F21S45/00
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05B 45/00 : Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/10 : Controlling the intensity of the light
• CPC Class Codes: H05B 45/3578 : Emulating the electrical or functional characteristics of discharge lamps
• CPC Class Codes: H05B 45/40 : Details of LED load circuits
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 : Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49227 : Insulator making

Abstract

Solid state lighting apparatuses and related methods are described. In some aspects, a solid state lighting apparatus includes a substrate. The substrate includes a non-metallic body having a first surface and one or more electrical components supported on the first surface of the substrate. At least one electrical component is spaced from the non-metallic body by one or more non-metallic layers. The apparatus can also include an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof. The apparatus can further include a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source. Related systems and methods are also disclosed.

Claims

1. A solid state lighting apparatus, comprising:

a substrate comprising;

a non-metallic body having a first surface; and

one or more electrical components supported on the first surface of the substrate, wherein at least a portion of one electrical component is spaced from the non-metallic body by one or more non-metallic layers;

an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof; and

a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source.

2. The apparatus of claim 1, wherein the array comprises a plurality of solid state light emitter segments, each segment comprising at least one solid state light emitter.

3. The apparatus of claim 1, wherein at least one solid state light emitter is directly disposed on the non-metallic body of the substrate.

4. The apparatus of claim 1, wherein at least one solid state light emitter is attached to the non-metallic body of the substrate using an adhesive agent.

5. The apparatus of claim 1, wherein at least one solid state light emitter adheres to the non-metallic body of the substrate via paste, epoxy, or silicone.

6. The apparatus of claim 1, wherein the one or more non-metallic layers attach to the non-metallic body via adhesive.

7. The apparatus of claim 2, wherein at least two different solid state light emitter segments of the plurality of solid state light emitter segments are arranged to be activated and/or deactivated at different times relative to one another during a portion of an AC cycle.

8. The apparatus of claim 1, further comprising at least one driver component arranged on or over the substrate, wherein the driver component is configured to monitor a line voltage and activate the solid state light emitters during a portion of the AC cycle.

9. The apparatus of claim 8, wherein the driver component is supported by the first surface and packaged.

10. The apparatus of claim 8, wherein the driver component is soldered to at least one electrical component of the substrate.

11. The apparatus of claim 8, wherein the driver component is wirebonded to at least one electrical component of the substrate.

12. The apparatus of claim 1, wherein at least one electrical component is directly attached to the non-metallic body.

13. The apparatus of claim 1, wherein a thermally conductive material is provided between at least one electrical component and the non-metallic body.

14. The apparatus of claim 1, further comprising at least one optical element positioned over the one or more solid state light emitters of the array of solid state light emitters.

15. The apparatus of claim 14, wherein the optical element comprises phosphor.

16. The apparatus of claim 2, wherein the plurality of solid state light emitter segments comprises at least two segments targeted to different color temperatures.

17. The apparatus of claim 16, wherein at least one light emitter segment targets a color temperature of approximately 2700K or below and another light emitter segment targets a color temperature of approximately 2700K or above.

18. The apparatus of claim 16, wherein at least one solid state light emitter segment targets a color temperature of approximately 1800K.

19. The apparatus of claim 1, wherein the receiver comprises a connector component comprising at least two openings adapted to receive portions of the AC power source for delivering AC current to the solid state light emitters.

20. The apparatus of claim 1, wherein the receiver comprises a circuit or a circuit element.

21. The apparatus of claim 1, further comprising electrically conductive vias provided within the substrate, wherein the vias are provided below either the solid state light emitters or a packaged driver component for dissipating heat therefrom.

22. The apparatus of claim 1, wherein at least one of the non-metallic layers comprises FR-4, fiberglass reinforced epoxy, polyimide, or a PCB laminate material.

23. The apparatus of claim 1, wherein non-metallic body comprises alumina (Al203), a ceramic, or a high reflectivity alumina.

24. The apparatus of claim 1, further comprising a reflective structure adapted to route AC current from the AC power source into the solid state lighting apparatus.

25. The apparatus of claim 24, wherein the structure comprises a top portion and a bottom portion adapted to enclose portions of the apparatus, such that only a light emission area of the apparatus is visible from an outside view.

26. The apparatus of claim 24, wherein the reflective structure is white.

27. The apparatus of claim 24, wherein the reflective structure comprises molded plastic.

28. The apparatus of claim 24, wherein the reflective structure comprises a slotted opening for routing electrical connectors from the AC power source directly into the apparatus.

29. The apparatus of claim 24, wherein the reflective structure comprises an inclined reflective surface extending between an opening of the structure and an uppermost surface of the structure.

30. The apparatus of claim 1, wherein a driver component is mounted to the first surface of the substrate.

31. The apparatus of claim 30, wherein the solid state light emitters comprise LED chips, and wherein a first LED chip is mounted to the first surface such that the first chip is planar with the driver component.

32. The apparatus of claim 31, wherein the driver component is wirebonded to at least one electrical component.

33. The apparatus of claim 32, wherein the driver component is wirebonded to the first LED chip.

34. The apparatus of claim 31, wherein a reflective structure is disposed between the driver component and the first LED chip.

35. The apparatus of claim 1, wherein the AC current to be received is rectified.

36. A solid state lighting system, comprising:

a substrate comprising a non-metallic body and one or more non-metallic layers, the non-metallic body having a top surface;

one or more solid state light emitters disposed on the top surface;

one or more electrical components mounted on the top surface and electrically coupled to the one or more solid state light emitters, wherein at least a portion of one electrical component is spaced from the non-metallic body by the one or more non-metallic layers; and

one or more electrically conductive vias provided in at least one non-metallic layer disposed between the at least one electrical component and the non-metallic body of the substrate.

37. The system of claim 36, wherein the vias are provided below either the solid state light emitters or a packaged driver component for dissipating heat therefrom.

38. The system of claim 36, wherein at least one electrical component is directly disposed on the non-metallic body.

39. The system of claim 36, wherein a thermally conductive material is provided between at least one electrical component and the non-metallic body.

40. The system of claim 36, wherein at least one solid state light emitter is directly disposed on the non-metallic body of the substrate.

41. The system of claim 36, further comprising a receiver supported by the top surface, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source.

42. The system of claim 36, wherein the solid state light emitters comprise a plurality of solid state light emitter segments, each segment comprising at least one solid state light emitter.

43. The system of claim 36, further comprising a driver component arranged on or over the top surface, wherein the driver component is configured to monitor a line voltage and activate the solid state light emitters during a portion of an AC cycle.

44. The system of claim 36, wherein the driver component is soldered to at least one electrical component of the substrate.

45. The system of claim 36, wherein the driver component is wirebonded to at least one electrical component of the substrate.

46. A method of providing a solid state lighting apparatus, the method comprising:

providing a substrate comprising;

a non-metallic body having a first surface; and

one or more electrical components mounted on the first surface of the substrate, wherein at least one electrical component is spaced from the non-metallic body by one or more non-metallic layers;

arranging an array of solid state light emitters over the first surface of the substrate, wherein the solid state light emitters and electrically coupled to the one or more electrical components thereof; and

providing a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source.

47. The method of claim 46, further comprising monitoring a line voltage and generating at least one control signal in response to the line voltage to activate at least one solid state light emitter segment of a plurality of solid state light emitter segments within the array.

48. The method of claim 46, wherein providing the substrate comprises providing one or more electrically conducive vias within the substrate, in portions of the substrate that support the solid state light emitters or a packaged driver component.

49. The method of claim 46, further comprising providing the substrate supporting the array of solid state light emitters within a housing.

50. The method of claim 46, wherein the housing is reflective, and wherein only a light emitter surface of the substrate is visible from outside of the housing.

51. A solid state lighting apparatus, comprising:

a substrate comprising;

a non-metallic body having a first surface; and

one or more electrical components supported on the first surface of the substrate;

an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof; and

a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source.

52. The apparatus of claim 51, wherein the array comprises a plurality of solid state light emitter segments, each segment comprising at least one solid state light emitter.

53. The apparatus of claim 51, wherein at least one solid state light emitter is attached to the non-metallic body of the substrate via an attachment agent.

54. The apparatus of claim 51, wherein at least one solid state light emitter adheres to the non-metallic body of the substrate via paste, adhesive, epoxy, or silicone.

55. The apparatus of claim 51, further comprising at least one driver component arranged on or over the substrate, wherein the driver component is configured to monitor a line voltage and activate the solid state light emitters during a portion of the AC cycle.

56. The apparatus of claim 55, wherein the driver component is supported by at least one of the electrical components.

57. The apparatus of claim 55, wherein the driver component is soldered to the electrical component.

58. The apparatus of claim 51, wherein the non-metallic body comprises alumina.

59. The apparatus of claim 51, further comprising at least one other electrical component arranged on or over the substrate, the at least one other electrical component comprises at least one resistor, fuse, diode, microelectronic device, or connector.