PACKAGE FOR ELECTRONIC COMPONENTS SUPPRESSING MULTIPACTOR DISCHARGE

• US 20150282357A1
• Filed: 03/30/2015
• Published: 10/01/2015
• Est. Priority Date: 03/31/2014
• Status: Active Grant

• Current Assignee: Sumitomo Electric Device Innovations Incorporated (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Device Innovations Incorporated (Sumitomo Corporation)
• Inventors: OSAWA, Ken, SAIGUSA, Harutoshi
• Granted Patent: US 9,437,509 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

A package for electronic components that suppress the multipactor discharge is disclosed. The package comprises a metal base and the casing. The metal base provides a pocket in the side thereof. The casing, mounted on the metal base to surround electronic components therein, provides a lead terminal connecting the electronic components to the outside and a feedthrough to isolate the lead terminal from the metal base. The pocket in the metal base is positioned beneath the lead terminal with an insulator therebetween.

Claims

1. A package for enclosing electronic components, comprising:

an electrically conductive base having a top surface that mounts the electronic components thereon;

a casing provided on the top surface of the base, the casing surrounding the electronic components therein; and

a feedthrough including an insulator and a conductive pattern formed on the insulator, the feedthrough passing through the casing,

wherein the base provides a pocket cut from an edge thereof the pocket being positioned beneath the feedthrough.

2. The package of claim 1,

further comprising a lead terminal extending outward from the conductive pattern in a portion outside of the casing, wherein the pocket has a width perpendicular to a direction of the lead terminal wider than or equal to a width of the insulator perpendicular to the lead terminal.

3. The package of claim 2,

wherein the conductive pattern has an outer edge retreated from an outer edge of the insulator, and the lead terminal forms a gap against the insulator at a portion where the conductive pattern is retreated.

4. The package of claim 3,

wherein the lead terminal has a reversed U-shape curved upwardly at the outer edge of the insulator.

5. The package of claim 1,

wherein the conductive pattern has an outer edge aligned with an outer edge of the insulator.

6. The package of claim 2,

wherein the lead terminal is fixed to the conductive pattern with brazing metal.

7. The package of claim 2,

wherein the lead terminal has a width perpendicular to the lead terminal narrower than a width of the conductive pattern perpendicular to the lead terminal, and the width of the conductive pattern is narrower than the width of the insulator.

8. The package of claim 1,

wherein the base provides a bottom surface opposite to the top surface, the pocket being cut from the bottom surface to the top surface.

9. The package of claim 8,

wherein the pocket provides a top end, a bottom end, and a deep end, the top end matching with the top surface of the base, the bottom end matching with the bottom surface of the base, and the deep end being in a position corresponding to the position on the top surface of the base outside from the casing.

10. The package of claim 1,

wherein the casing is made of metal.

11. The package of claim 10,

wherein the feedthrough has another insulator surrounding the conductive pattern accompanied with the insulator at the casing.

12. The package of claim 1,

wherein the electronic components include a field effect transistor (FET) including nitride semiconductor materials, the FET outputting a high frequency signal with power exceeding 100 W.

13. The package of claim 1,

wherein the insulator is made of ceramics.