PASSIVE RF TAG WITH MULTIPLE CONDUCTIVE COILS

• US 20150286847A1
• Filed: 04/03/2014
• Published: 10/08/2015
• Est. Priority Date: 04/03/2014
• Status: Abandoned Application

• Current Assignee: Tyfone Incorporated
• Original Assignee: Tyfone Incorporated
• Inventors: Narendra, Siva G.
• Application Number:
  US14/244,845
• Publication Number:
  US 20150286847A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0709 the source being an interrogation field
• CPC Class Codes: G06K 19/07766 comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
• CPC Class Codes: G06K 7/10158 methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: G06K 7/10356 using a plurality of antennas, e.g. configurations including means to resolve interference between the plurality of antennas

Abstract

A passive tag embedded in a package includes multiple conductive coils. A first coil receives radio frequency (RF) energy used to power the tag. Additional coils receive and/or transmit data signals, clock signals, and carrier signals. The RF energy and other signals may be at different frequencies. An RF probe includes a first coil to emit the RF energy to power the tag. The RF probe includes additional coils corresponding to the additional coils in the tag. The RF probe may turn off the RF signal used for power during communication. The RF energy may be rectified to provide DC power to circuits in the tag, or may be used directly for adiabatic circuits. The RF probe and the package may have complementary shapes to facilitate alignment of the coils.

Claims

1. An apparatus comprising:

an integrated circuit die having a footprint, the integrated circuit die including at least one digital logic circuit and a power conditioning circuit to provide power to the at least one digital logic circuit;

a first conductive coil having a plurality of turns electrically coupled to the power conditioning circuit to receive power from an electromagnetic signal at a first frequency; and

a second conductive coil having a plurality of turns to receive data modulated on a carrier signal at a second frequency;

wherein the first and second conductive coils are affixed to the integrated circuit die.

2. The apparatus of claim 1 wherein the first and second conductive coils are within the footprint of the integrated circuit die.

3. The apparatus of claim 2 wherein the first and second conductive coils are integrated in the integrated circuit die.

4. The apparatus of claim 1 wherein the first and second frequencies are the same.

5. The apparatus of claim 1 wherein the first and second frequencies are different.

6. The apparatus of claim 1 wherein the integrated circuit die further includes a data input/output circuit electrically coupled between the at least one digital logic circuit and the second conductive coil to extract incoming data modulated on the carrier signal, and to transmit outgoing data by modulating the carrier signal

7. The apparatus of claim 6 further comprising a third conductive coil with a plurality of turns to receive a carrier signal at the second frequency.

8. The apparatus of claim 6 further comprising a third conductive coil with a plurality of turns to receive a clock signal modulated on a carrier signal at the second frequency.

9. The apparatus of claim 8 further comprising a fourth conductive coil with a plurality of turns to receive a carrier signal at the second frequency.

10. The apparatus of claim 1 further comprising a third conductive coil with a plurality of turns to transmit output data modulated at the second frequency.

11. The apparatus of claim 10 wherein the integrated circuit die further includes a clock recovery circuit electrically coupled to the second conductive coil to extract a clock signal from electromagnetic energy received from the second conductive coil.

12. The apparatus of claim 10 wherein the integrated circuit die further includes a clock recovery circuit electrically coupled to the third conductive coil to extract a clock signal from electromagnetic energy received from the third conductive coil.

13. A radio frequency (RF) probe to communicate with a passive tag, the RF probe comprising:

a first conductive coil with a plurality of turns to emit a constant wave (CW) signal at a first frequency to provide a source of power to the passive tag;

a second conductive coil with a plurality of turns to emit an RF data signal at a second frequency, wherein the RF data signal at the second frequency includes outgoing digital data modulated thereon by the RF probe; and

a third conductive coil to emit an RF clock signal at the second frequency, wherein the RF clock signal at the second frequency includes a digital clock signal modulated thereon by the radio frequency probe.

14. The RF probe of claim 13 further comprising data input/output circuitry coupled to the second conductive coil to modulate a carrier signal with the outgoing data, and to demodulated incoming digital data received from the second conductive coil.

15. The RF probe of claim 14 further comprising a fourth conducive coil to emit an RF carrier signal at the second frequency.

16. The RF probe of claim 13 further comprising data input circuitry coupled to the third conductive coil to modulate a carrier signal with the outgoing data, and to demodulate incoming digital data received from the second conductive coil.

17. A radio frequency (RF) probe to communicate with a passive tag, the RF probe comprising:

a first conductive coil with a plurality of turns to emit a constant wave (CW) signal at a first frequency to provide a source of power to the passive tag;

a second conductive coil with a plurality of turns to emit an RF data signal at a second frequency, wherein the RF data signal at the second frequency includes outgoing digital data modulated thereon by the RF probe; and

a third conductive coil to emit an RF carrier signal at the second frequency.

18. The RF probe of claim 17 further comprising data input circuitry coupled to the second conductive coil to demodulate incoming digital data received from the second conductive coil.

19. The RF probe of claim 17 further comprising clock circuitry coupled to the second conductive coil to modulate a digital clock signal on the RF data signal.