RF PROBE ALIGNMENT WITH PASSIVE TAG
First Claim
1. An apparatus comprising:
- a product;
a package to house the product; and
a passive integrated circuit used to uniquely identify the product when the passive integrated circuit is in communication with a radio frequency (RF) probe;
wherein the package includes a surface feature matching a feature of the RF probe to facilitate alignment of the RF probe and the passive integrated circuit.
3 Assignments
0 Petitions
Accused Products
Abstract
A passive tag embedded in a package includes multiple conductive coils. A first coil receives radio frequency (RF) energy used to power the tag. Additional coils receive and/or transmit data signals, clock signals, and carrier signals. The RF energy and other signals may be at different frequencies. An RF probe includes a first coil to emit the RF energy to power the tag. The RF probe includes additional coils corresponding to the additional coils in the tag. The RF probe may turn off the RF signal used for power during communication. The RF energy may be rectified to provide DC power to circuits in the tag, or may be used directly for adiabatic circuits. The RF probe and the package may have complementary shapes to facilitate alignment of the coils.
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Citations
16 Claims
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1. An apparatus comprising:
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a product; a package to house the product; and a passive integrated circuit used to uniquely identify the product when the passive integrated circuit is in communication with a radio frequency (RF) probe; wherein the package includes a surface feature matching a feature of the RF probe to facilitate alignment of the RF probe and the passive integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An apparatus comprising:
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a passive integrated circuit having a plurality of conductive coils that must be aligned with corresponding conductive coils in a radio frequency (RF) probe to effect communications between the passive integrated circuit and the RF probe; and a package having an indentation within which the passive integrated circuit is located, wherein the package includes a surface feature matching a feature of the RF probe to facilitate alignment of the conductive coils on the passive integrated circuit with the conductive coils on the RF probe. - View Dependent Claims (10, 11, 12)
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13. A radio frequency (RF) probe to communicate with a passive tag, the RF probe comprising:
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a tip at which radio frequency (RF) signals are emitted to communicate with the passive tag; a first conductive coil with a plurality of turns to emit a signal at a first frequency to provide a source of power to the passive tag, the first conductive coil being located at the tip of the RF probe; and a second conductive coil with a plurality of turns to emit an RF data signal at a second frequency, the second conductive coil being located at the tip of the RF probe; wherein the tip of the RF probe is formed into a shape that facilitates alignment of the first and second conductive coils on the tip of the RF probe with corresponding first and second conductive coils on the passive tag. - View Dependent Claims (14, 15, 16)
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Specification