PASSIVE RF TAG WITH ADIABATIC CIRCUITS
First Claim
1. An apparatus comprising:
- an integrated circuit die having a footprint, the integrated circuit die including at least one adiabatic logic circuit;
a first conductive coil having a plurality of turns electrically coupled to power the at least one adiabatic logic circuit from an electromagnetic signal at a first frequency; and
a second conductive coil having a plurality of turns to receive data modulated on a carrier signal at a second frequency;
wherein the first and second conductive coils are mechanically affixed to the integrated circuit die.
3 Assignments
0 Petitions
Accused Products
Abstract
A passive tag embedded in a package includes multiple conductive coils. A first coil receives radio frequency (RF) energy used to power the tag. Additional coils receive and/or transmit data signals, clock signals, and carrier signals. The RF energy and other signals may be at different frequencies. An RF probe includes a first coil to emit the RF energy to power the tag. The RF probe includes additional coils corresponding to the additional coils in the tag. The RF probe may turn off the RF signal used for power during communication. The RF energy may be rectified to provide DC power to circuits in the tag, or may be used directly for adiabatic circuits. The RF probe and the package may have complementary shapes to facilitate alignment of the coils.
-
Citations
15 Claims
-
1. An apparatus comprising:
-
an integrated circuit die having a footprint, the integrated circuit die including at least one adiabatic logic circuit; a first conductive coil having a plurality of turns electrically coupled to power the at least one adiabatic logic circuit from an electromagnetic signal at a first frequency; and a second conductive coil having a plurality of turns to receive data modulated on a carrier signal at a second frequency; wherein the first and second conductive coils are mechanically affixed to the integrated circuit die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. An apparatus comprising:
-
an integrated circuit die having a footprint, the integrated circuit die including at least one adiabatic logic circuit; a first conductive coil having a plurality of turns electrically coupled to power the at least one adiabatic logic circuit from an electromagnetic signal at a first frequency; a second conductive coil having a plurality of turns; and a data output circuit to transmit data by modulating an impedance of the second conductive coil when the second conductive coil is in the presence of a carrier signal; wherein the first and second conductive coils are mechanically affixed to the integrated circuit die. - View Dependent Claims (10, 11, 12, 13, 14, 15)
-
Specification