CHIP COIL COMPONENT AND BOARD FOR MOUNTING THE SAME

• US 20150287514A1
• Filed: 06/30/2014
• Published: 10/08/2015
• Est. Priority Date: 04/02/2014
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LIM, Bong Sup
• Application Number:
  US14/320,087
• Publication Number:
  US 20150287514A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/0026 Multilayer LC-filter
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

A chip coil component may include: a ceramic body in which a plurality of magnetic layers are stacked; and an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers to be electrically connected. The ceramic body may include an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and a thickness of the second cover layer may be greater than that of the first cover layer.

Claims

1. A chip coil component, comprising:

a ceramic body in which a plurality of magnetic layers are stacked; and

an internal coil part disposed inside the ceramic body and having a plurality of internal coil patterns disposed on the plurality of magnetic layers and electrically connected to each other,

wherein the ceramic body includes an active layer, which is a capacitance forming part, and first and second cover layers disposed on and below the active layer in a thickness direction of the ceramic body, and

a thickness of the second cover layer is greater than that of the first cover layer.

2. The chip coil component of claim 1, wherein a ratio of the thickness of the first cover layer and the thickness of the second cover layer is 1:

3.

3. The chip coil component of claim 1, further comprising external electrodes disposed on both end surfaces of the ceramic body in a length direction of the ceramic body and top and bottom surfaces of the ceramic body to be connected to the internal coil part.

4. The chip coil component of claim 3, wherein a length of a portion of the external electrode disposed on the top surface of the ceramic body in the length direction of the ceramic body is less than that of a portion of the external electrode disposed on the bottom surface of the ceramic body in the length direction of the ceramic body.

5. The chip coil component of claim 3, wherein a length of a portion of the external electrode disposed on the top surface of the ceramic body in the length direction of the ceramic body is 50 μ

m, and

a length of a portion of the external electrode disposed on the bottom surface of the ceramic body in the length direction of the ceramic body is 150 μ

m.

6. The chip coil component of claim 1, further comprising a marking pattern disposed on a bottom surface of the ceramic body provided as a mounting surface or a top surface of the ceramic body opposing the bottom surface of the ceramic body.

7. The chip coil component of claim 1, wherein the plurality of internal coil patterns are provided in an amount of N (4≦

N, where N is a natural number) on the plurality of magnetic layers,

an n-th (n≦

N, where n is a multiple of

     2) internal coil pattern and an n−

1-th internal coil pattern, based on an internal coil pattern closest to the bottom surface of the ceramic body among the N internal coil patterns, have the same shape, and

the n-th internal coil pattern and the n−

1-th internal coil pattern are connected to each other through a connection terminal.

8. The chip coil component of claim 7, wherein the connection terminal includes at least two via electrodes.

9. A chip coil component, comprising:

a ceramic body in which a plurality of magnetic layers are stacked;

an active layer disposed within the ceramic body and configured to form capacitance by including a plurality of internal electrodes disposed to face each other, with at least one of the magnetic layers interposed therebetween;

a first cover layer disposed above an uppermost internal electrode within the active layer;

a second cover layer disposed below a lowermost internal electrode within the active layer and having a thickness greater than that of the first cover layer; and

external electrodes disposed on both end surfaces of the ceramic body in a length direction of the ceramic body and on bottom and top surfaces of the ceramic body,

wherein a length of a portion of the external electrode disposed on the bottom surface of the ceramic body in the length direction of the ceramic body is greater than that of a portion of the external electrode disposed on the top surface of the ceramic body in the length direction of the ceramic body.

10. The chip coil component of claim 9, wherein a ratio of the thickness of the first cover layer and the thickness of the second cover layer is 1:

3.

11. The chip coil component of claim 9, wherein the length of the portion of the external electrode disposed on the top surface of the ceramic body in the length direction of the ceramic body is 50 μ

m, and

the length of the portion of the external electrode disposed on the bottom surface of the ceramic body in the length direction of the ceramic body is 150 μ

m.

12. The chip coil component of claim 9, wherein the plurality of internal electrodes are provided in an amount of N (4≦

N, where N is a natural number) on the plurality of magnetic layers,

an n-th (n≦

N, where n is a multiple of

     2) internal electrode and an n−

1-th internal electrode, based on an internal electrode closest to the bottom surface of the ceramic body among the N internal electrodes, have the same shape, and

the n-th internal electrode and the n−

1-th internal electrode are connected to each other through a connection terminal.

13. The chip coil component of claim 12, wherein the connection terminal includes at least two via electrodes.

14. Aboard for mounting a chip coil component, the board comprising:

a printed circuit board on which first and second electrode pads are provided; and

the chip coil component disposed on the printed circuit board,

wherein the chip coil component includes;

a ceramic body in which a plurality of magnetic layers are stacked;

an active layer disposed within the ceramic body and configured to form capacitance by including a plurality of internal electrodes disposed to face each other, with at least one of the magnetic layers interposed therebetween;

a first cover layer disposed above an uppermost internal electrode within the active layer;

a second cover layer disposed below a lowermost internal electrode within the active layer and having a thickness greater than that of the first cover layer; and

external electrodes disposed on both end surfaces of the ceramic body in a length direction of the ceramic body and on bottom and top surfaces of the ceramic body to be connected to the internal electrodes.

15. The board of claim 14, wherein a length of a portion of the external electrode disposed on the top surface of the ceramic body in the length direction of the ceramic body is less than that of a portion of the external electrode disposed on the bottom surface of the ceramic body in the length direction of the ceramic body.

16. The board of claim 14, wherein the plurality of internal electrodes are provided in an amount of N (4≦

N, where N is a natural number) on the plurality of magnetic layers,

an n-th (n≦

N, where n is a multiple of

     2) internal electrode and an n−

1-th internal electrode, based on an internal electrode closest to the bottom surface of the ceramic body among the N internal electrodes, have the same shape, and

the n-th internal electrode and the n−

1-th internal electrode are connected to each other through a connection terminal.

17. The board of claim 16, wherein the connection terminal includes at least two via electrodes.