INVERTER DEVICE
First Claim
1. An inverter device comprising:
- a housing;
a semiconductor module accommodated in the housing;
a first heat exchanger having a first passage defined by an outer surface of the housing and a passage forming member that covers at least a portion of the outer surface, wherein the first heat exchanger is thermally coupled to a heat generating component;
a second heat exchanger arranged in the housing, wherein the second heat exchanger has a second passage stacked on the first passage and is thermally coupled to the semiconductor module;
a supply port connected to a supply pipe for supplying coolant from a coolant supply source to the first heat exchanger or the second heat exchanger;
a discharge port connected to a discharge pipe, wherein the discharge pipe discharges coolant from the first heat exchanger or the second heat exchanger to the coolant supply source; and
a communication line that allows the first passage and the second passage to communicate with each other,wherein the first heat exchanger and the second heat exchanger are formed separately.
1 Assignment
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Accused Products
Abstract
An inverter device includes: a housing; semiconductor modules; a first heat exchanger having a first passage, wherein a heat generating component is thermally coupled to the first heat exchanger; a second heat exchanger provided inside the housing; a supply port connected to a supply pipe for supplying coolant; a discharge port connected to a discharge pipe, wherein the discharge pipe discharges coolant from the first heat exchanger or the second heat exchanger to a coolant supply source; a discharge port connected to a discharge pipe, which discharges coolant from the first heat exchanger or the second heat exchanger to the coolant supply source; and communication lines which allow the first passage and a second passage to communicate with each other.
29 Citations
6 Claims
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1. An inverter device comprising:
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a housing; a semiconductor module accommodated in the housing; a first heat exchanger having a first passage defined by an outer surface of the housing and a passage forming member that covers at least a portion of the outer surface, wherein the first heat exchanger is thermally coupled to a heat generating component; a second heat exchanger arranged in the housing, wherein the second heat exchanger has a second passage stacked on the first passage and is thermally coupled to the semiconductor module; a supply port connected to a supply pipe for supplying coolant from a coolant supply source to the first heat exchanger or the second heat exchanger; a discharge port connected to a discharge pipe, wherein the discharge pipe discharges coolant from the first heat exchanger or the second heat exchanger to the coolant supply source; and a communication line that allows the first passage and the second passage to communicate with each other, wherein the first heat exchanger and the second heat exchanger are formed separately. - View Dependent Claims (2, 3, 5, 6)
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4. (canceled)
Specification