Capacitive Sensing Button On Chip
5 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus include a plurality of sensor elements arranged within an integrated circuit package and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements. The controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements. The receive signal represents a mutual capacitance of the first sensor element and the second sensor element.
8 Citations
40 Claims
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1-20. -20. (canceled)
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21. An integrated circuit package comprising:
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a plurality of sensor elements arranged within the integrated circuit package; and a controller arranged within the integrated circuit package and coupled to the plurality of sensor elements, wherein the controller is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements, the receive signal representing a mutual capacitance of the first sensor element and the second sensor element. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A system comprising:
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a device including user interface circuitry; and a circuit package coupled to the user interface circuitry, the circuit package comprising; a plurality of sensor elements located within the circuit package; and a logic circuitry located within the circuit package and coupled to the plurality of sensor elements, wherein the logic circuitry is configured to apply a transmit signal to a first sensor element of the plurality of sensor elements and receive a receive signal from a second sensor element of the plurality of sensor elements, the receive signal representing a mutual capacitance of the first sensor element and the second sensor element. - View Dependent Claims (33, 34, 35, 36, 37)
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38. A method comprising:
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applying a transmit signal, from within an integrated circuit package, to a first sensor element of a plurality of sensor elements arranged within the integrated circuit package; and receiving a receive signal, within the integrated circuit package, from a second sensor element of the plurality of sensor elements, wherein the receive signal represents a mutual capacitance of the first sensor element and the second sensor element. - View Dependent Claims (39, 40)
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Specification