Fingerprint Sensor Module, Portable Electronic Device Including Same, and Method for Manufacturing Same

• US 20150294135A1
• Filed: 11/20/2013
• Published: 10/15/2015
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Crucialtec Co., Ltd
• Original Assignee: Crucialtec Co., Ltd
• Inventors: Kim, Jong Uk, Lee, Jae Hak, Lee, Doo Hwan, Lee, Jin Young, Tan, Hyun Kyu, Lim, Sung Ki, Lee, Seok Joon, Hong, Sung Moo
• Granted Patent: US 9,443,126 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.

Claims

1. A fingerprint sensor module comprising:

a fingerprint sensor having a sensing part formed on a substrate using a conductor and a sensor circuit part electrically connected to the sensing part;

a bracket configured to accommodate the sensing part and seat the fingerprint sensor; and

a post-processing layer disposed on a contact surface formed on the bracket to face an upper surface of the sensing part,

wherein the sum of a thickness of a supporting layer between the upper surface of the sensing part and the contact surface and a thickness of the post-processing layer is in the range of 0.04 to 0.06 mm.

2. The module of claim 1, wherein the post-processing layer includes a primer layer, a color paint layer, and a protective layer.

3. The module of claim 2, wherein the primer layer has a thickness of 0.002 to 0.003 mm, the color paint layer has a thickness of 0.003 to 0.005 mm, and the protective layer has a thickness of 0.02 to 0.022 mm.

4. The module of claim 1, wherein the supporting layer has a thickness of 0.015 to 0.03 mm.

5. The module of claim 1, wherein the fingerprint sensor is fixed by filling a molding material into the bracket or inserting and coupling with an additional bracket.

6. A portable electronic device comprising the fingerprint sensor module according to claim 1.

13. A portable electronic device comprising the fingerprint sensor module according to claim 2.

14. A portable electronic device comprising the fingerprint sensor module according to claim 3.

15. A portable electronic device comprising the fingerprint sensor module according to claim 4.

16. A portable electronic device comprising the fingerprint sensor module according to claim 5.

7. A method of manufacturing a fingerprint sensor module, comprising:

a) accommodating a sensing part formed on a substrate of a fingerprint sensor using a conductor in a bracket and seating the fingerprint sensor in the bracket; and

b) forming a post-processing layer on a contact surface formed on the bracket to face an upper surface of the sensing part,

wherein the sum of a thickness of a supporting layer between the upper surface of the sensing part and the contact surface and a thickness of the post-processing layer is in a range of 0.04 to 0.06 mm.

8. The method of claim 7, wherein the foaming of the post-processing layer (step b) includes sequentially forming a primer layer, a color paint layer, and a protective layer.

9. The method of claim 8, wherein the primer layer has a thickness of 0.002 to 0.003 mm, the color paint layer has a thickness of 0.003 to 0.005 mm, and the protective layer has a thickness of 0.02 to 0.022 mm.

10. The method of claim 7, wherein the supporting layer has a thickness of 0.015 to 0.03 mm.

11. The method of claim 7, wherein before forming the post-processing layer (step b), the method further includes polishing the contact surface.

12. The method of claim 7, wherein after seating the fingerprint sensor in the bracket (step a), the method includes fixing the fingerprint sensor by filling a molding material into the bracket or inserting and coupling with an additional bracket.