Device for Cooling Power Electronics by Means of a Cooling Medium and Method for Producing the Device
First Claim
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1. A device for cooling power electronics by means of a cooling medium, comprising:
- power electronics arranged in a housing,a housing attachment which is arranged at the housing in such a way that the housing attachment and the housing form a space for receiving the cooling medium,wherein the housing has at least one bottom part and one top part, wherein both housing parts are designed to be connected by means of a laser welding process,wherein the housing attachment and the housing are designed to be connected by means of a laser welding process, andwherein the housing and the housing attachment consist of aluminum.
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Abstract
A device for cooling power electronics by means of a cooling medium. The power electronics are arranged in a housing.
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10 Claims
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1. A device for cooling power electronics by means of a cooling medium, comprising:
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power electronics arranged in a housing, a housing attachment which is arranged at the housing in such a way that the housing attachment and the housing form a space for receiving the cooling medium, wherein the housing has at least one bottom part and one top part, wherein both housing parts are designed to be connected by means of a laser welding process, wherein the housing attachment and the housing are designed to be connected by means of a laser welding process, and wherein the housing and the housing attachment consist of aluminum. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for producing a device for cooling power electronics, which comprises the following steps:
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Connecting by means of a laser welding process a bottom part and a top part of a housing to form a housing, wherein power electronics are arranged in the housing (3), and Connecting by means of a laser welding process the housing with a housing attachment, wherein the housing attachment and the housing form a space for receiving a cooling medium, and wherein the housing and the housing attachment consist of aluminum.
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10. A method for producing a device for cooling power electronics, which comprises the following steps:
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Connecting by means of a laser welding process a top part and a housing attachment of a housing to form a housing, wherein the housing attachment and the top part of the housing form a space for receiving a cooling medium, and Connecting by means of a laser welding process a bottom part and a top part of a housing to form a housing, wherein power electronics are arranged in the housing, and wherein the housing and the housing attachment consist of aluminum.
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Specification