PIEZOELECTRIC TRANSDUCERS USING MICRO-DOME ARRAYS

• US 20150298173A1
• Filed: 06/29/2015
• Published: 10/22/2015
• Est. Priority Date: 02/15/2011
• Status: Active Grant

• Current Assignee: Fujifilm Dimatix, Inc. (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Dimatix, Inc. (Fujifilm Holdings Corporation)
• Inventors: Bibl, Andreas, Law, Hung-fai Stephen, von Essen, Kevin, Ottosson, Mats G.
• Granted Patent: US 9,919,342 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B06B 1/0207 Driving circuits specially adapted for particular applications, see the relevant subclass, e.g. G01; circuits for steering transducer arrays G10K11/34; basic circuits H03
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: B06B 1/0637 Spherical array
• CPC Class Codes: B06B 1/0644 using a single piezoelectric element B06B1/0688 takes precedence
• CPC Class Codes: B06B 2201/76 Medical, dental
• CPC Class Codes: G10K 11/32 characterised by the shape of the source
• CPC Class Codes: H10N 30/076 by vapour phase deposition
• CPC Class Codes: H10N 30/1051 based on piezoelectric or electrostrictive films or coatings
• CPC Class Codes: H10N 30/20 with electrical input and mechanical output, e.g. functioning as actuators or vibrators
• CPC Class Codes: H10N 30/2048 having non-planar shape
• CPC Class Codes: H10N 30/704 based on piezoelectric or electrostrictive films or coatings
• CPC Class Codes: H10N 30/80 Constructional details
• CPC Class Codes: H10N 30/87 Electrodes or interconnections, e.g. leads or terminals

Abstract

An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.

Claims

1-35. -35. (canceled)

36. A device for generating pressure waves in an external medium, comprising:

a handle portion having a first distal end; and

a transducer portion attached to the handle portion in proximity to the first distal end of the handle portion, the transducer portion comprising

a support structure having a plurality of apertures;

a plurality of transducer elements, the plurality of transducer elements sharing a common reference electrode, each transducer element comprising a respective drive electrode and a respective piezoelectric element disposed between the respective drive electrode and the common reference electrode, wherein each transducer element has an outer surface positioned to receive or generate pressure waves in the external medium, and wherein the drive electrode, the common reference electrode, and the piezoelectric element of each transducer element each include a respective flexible portion and a respective stationary portion connected to the respective flexible portion,

wherein the flexible portions of the drive electrode, reference electrode, and piezoelectric element of the plurality of transducer elements are suspended over the apertures in the support structure and are curved in a first direction relative to the aperture in the absence of an applied voltage between the drive electrode and the reference electrode and in the absence of an applied force that increases mechanical stress on the flexible portion, and wherein the flexible portions of the reference electrode, drive electrode, and piezoelectric element deflect in response to a driving voltage applied between the drive electrode and the reference electrode.

37. The device of claim 36, wherein the handle portion has a larger size in a length dimension than in a width dimension perpendicular to the width dimension.

38. The device of claim 37, wherein the plurality of vibrating elements are distributed in a first plane substantially perpendicular to the length dimension of the handle portion.

39. The device of claim 37, wherein the plurality of vibrating elements are distributed in a first plane substantially parallel to the length dimension of the handle portion.

40. The device of claim 37, wherein the plurality of vibrating elements are distributed in a plane substantially perpendicular to the length dimension of the handle portion, and within an annular area.

41. The device of claim 37, wherein the plurality of vibrating elements are distributed on a plurality of planes that are parallel to the length dimension of the handle portion and are at an equal distance to a common axis.

42. The device of claim 36, wherein the support structure comprises a base having the first surface and a plurality of cavities formed in the first surface of the base to provide the plurality of apertures.

43. The device of claim 36, wherein the support structure comprises a base and a plurality of supports between the base and the plurality of transducer elements, and wherein the plurality of apertures are formed through the plurality of supports, and wherein the base spans the plurality of apertures.

44. The device of claim 43, wherein the plurality of supports are conductive.

45. The device of claim 44, wherein the plurality of supports comprise metal rings.

46. The device of claim 45, wherein the metal rings provide eutectic bonds between the base and the plurality of transducer element.

47. The device of claim 44, wherein the plurality of supports electrically connect the plurality of transducer elements to integrated circuits formed in the base.

48. The device of claim 36, wherein the outer surface includes a flexible film covering the drive electrode or reference electrode.

49. The device of claim 36, wherein the plurality of transducer elements are substantially identical transducer elements.

50. The device of claim 49, wherein the plurality of transducer elements are formed in a continuous layer that spans the plurality of supports.

51. The device of claim 50, wherein the transducer-elements form a linear array of substantially identical transducer elements.

52. The device of claim 50, wherein the transducer elements form a two dimensional array of substantially identical transducer elements.

53. The device of claim 36, wherein the support structure includes integrated circuitry configured to independently sense pressure changes applied to the outer surface of the respective transducer elements of the plurality of transducer elements.

54. The device of claim 36, wherein the drive electrode is positioned closer to the support structure than the reference electrode.

55. The device of claim 36, wherein the flexible portions of the drive electrode, reference electrode, and piezoelectric element of each transducer element are each curved away from the apertures.

56. The device of claim 36, wherein the flexible portions of the drive electrode, reference electrode, and piezoelectric element of each transducer element are each curved toward the apertures.

57. The device of claim 36, wherein the piezoelectric element of each transducer element includes a curved portion surrounded by a planar portion, and wherein the planar portion and a peripheral portion of the portion of the piezoelectric element are part of the stationary portion of the piezoelectric element.