MULTILAYER FILM INCLUDING FIRST AND SECOND DIELECTRIC LAYERS

• US 20150302990A1
• Filed: 11/21/2013
• Published: 10/22/2015
• Est. Priority Date: 11/21/2012
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Ghosh, Dipankar, Lyons, Christopher S., Gorrell, Robin E., Maki, Stephen P.
• Application Number:
  US14/646,648
• Publication Number:
  US 20150302990A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/083 of refractory metals or yttrium
• CPC Class Codes: C23C 14/34 Sputtering
• CPC Class Codes: C23C 16/22 characterised by the deposition of inorganic material, other than metallic material
• CPC Class Codes: C23C 28/32 including at least one pure metallic layer
• CPC Class Codes: C23C 28/3455 with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: H01G 4/10 Metal-oxide dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/20 using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 H01G4/12 takes precedence
• CPC Class Codes: H01G 4/206 inorganic and synthetic material
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: H01L 28/56 the dielectric comprising two or more layers, e.g. comprising buffer layers, seed layers, gradient layers
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/4655 by using a laminate characterized by the insulating layer general-purpose insulating materials H05K1/03, H05K3/4673

Abstract

A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including first and second electrically conductive layers separated by at least first and second dielectric layers is also disclosed. The first dielectric layer is disposed on the first electrically conductive layer, and the second dielectric layer is disposed on the first dielectric layer. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic.

Claims

1. A multilayer film, comprising:

first and second electrically conductive layers separated by at least first and second dielectric layers, with the first and second electrically conductive layers each having an average visible light transmission of less than about ten percent;

wherein the first dielectric layer is formed directly on the first electrically conductive layer by condensation of a vaporized liquid; and

wherein the second dielectric layer is formed directly on the first dielectric layer, the second dielectric layer not being formed by condensation of a vaporized liquid.

20. The multilayer film of claim 1, wherein the multilayer film comprises a plurality of alternating first and second dielectric layers.

2. A multilayer film, comprising:

first and second electrically conductive layers separated by at least first and second dielectric layers, wherein the first electrically conductive layer has at least one of an average surface roughness of at least ten nanometers, or a thickness of at least ten micrometers;

wherein the first dielectric layer comprises a polymer and is disposed on the first electrically conductive layer; and

wherein the second dielectric layer comprises a ceramic and is disposed on the first dielectric layer.

3. The multilayer film of claim 2, wherein both the first electrically conductive layer and the second electrically conductive layer have a thickness of at least 10 micrometers.

4. The multilayer film of claim 2, wherein the first and second electrically conductive layers comprise metal.

5. The multilayer film of claim 4, wherein the first electrically conductive layer is a metal foil.

6. The multilayer film of claim 2, wherein the second electrically conductive layer is a metal layer electroplated on the second dielectric layer.

7. The multilayer film of claim 2, wherein substantial portions of each two neighboring layers in the multilayer film are in physical contact with each other.

11. The multilayer film of claim 2, wherein the first dielectric layer has a dielectric constant less than 20 and wherein the second dielectric layer has a dielectric constant more than 20.

12. The multilayer film of claim 2, wherein the first dielectric layer has a thickness of up to one micrometer.

13. The multilayer film of claim 2, wherein the second dielectric layer is formed by sputtering.

14. The multilayer film of claim 2, wherein the second dielectric layer has a thickness of up to one micrometer.

15. The multilayer film of claim 2, wherein the second dielectric layer comprises zirconia.

16. The multilayer film of claim 2, the multilayer film being flexible.

17. The multilayer film of claim 2, wherein the multilayer film comprises a plurality of alternating first and second dielectric layers.

18. The multilayer film of claim 15, wherein the second dielectric layer comprises yttria-stabilized zirconia.

19. The multilayer film of claim 2, wherein the average surface roughness of the first electrically conductive layer on which the first dielectric layer is formed is at least 10 nanometers.

8. A multilayer dielectric film, comprising:

a first dielectric layer comprising a first material having a first breakdown field strength; and

a second dielectric layer formed directly on the first dielectric layer and comprising a second material having a second breakdown field strength less than the first breakdown field strength,

wherein the first dielectric layer has a third breakdown field strength at a localized position that is less than the second breakdown field strength, and wherein the multilayer dielectric film has a fourth breakdown field strength at the localized position that is greater than the third breakdown field strength.

9. The multilayer dielectric film of claim 8, wherein the first dielectric layer is formed by a condensation of a vaporized liquid.

10. The multilayer dielectric film of claim 8, wherein the second dielectric layer is not formed by a condensation of a vaporized liquid.