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Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same

  • US 20150303174A1
  • Filed: 07/09/2014
  • Published: 10/22/2015
  • Est. Priority Date: 04/17/2014
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a first fan-out tier comprising;

    a first device die;

    a first molding compound extending along sidewalls of the first device die; and

    a first through intervia (TIV) extending through the first molding compound;

    one or more first fan-out redistribution layers (RDLs) over the first fan-out tier and bonded to the first device die;

    a second fan-out tier over the one or more first fan-out RDLs, wherein the second fan-out tier comprises a second device die bonded to the one or more first fan-out RDLs, wherein the one or more first fan-out RDLs electrically connects the first device die to the second device die;

    one or more second fan-out RDLs on an opposing side of the first fan-out tier as the one or more first fan-out RDLs, wherein the first TIV electrically connects the one or more first fan-out RDLs to the one or more second fan-out RDLs; and

    a plurality of external connectors at least partially disposed in the one or more second fan-out RDLs, wherein the plurality of external connectors are further disposed on conductive features in the one or more second fan-out RDLs.

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