EBG DESIGNS FOR MITIGATING RADIO FREQUENCY INTERFERENCE

• US 20150303562A1
• Filed: 04/22/2014
• Published: 10/22/2015
• Est. Priority Date: 04/22/2014
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Joseph Chen
• Inventors: CHEN, Joseph
• Granted Patent: US 10,403,973 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/242 specially adapted for hand-held use
• CPC Class Codes: H01Q 1/52 Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure absorbing means H01Q17/00
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H01Q 15/008 said selective devices having Sievenpipers' mushroom elements

Abstract

An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.

Claims

1. An apparatus for electromagnetic interference shielding, comprising:

an electromagnetic bandgap (EBG) structure;

a surface of the apparatus, wherein the EBG structure is attached to the surface to mitigate electromagnetic interference propagation within the apparatus.

2. The apparatus of claim 1, wherein the apparatus is a chassis of an electronic device, and the EBG structure is attached to one surface of the chassis.

3. The apparatus of claim 1, wherein the apparatus is a heat sink, and the EBG structure is attached to one surface of the heat sink.

4. The apparatus of claim 1, wherein the apparatus is a heat pipe, and the EBG structure is attached to one surface of the heat pipe.

5. The apparatus of claim 1, wherein the apparatus is a heat spreader, and the EBG structure is attached to one surface of the heat spreader.

6. The apparatus of claim 1, wherein the EBG structure is adjusted to block a frequency band electromagnetic interference, such that a selective frequency of electromagnetic interference is mitigated.

7. The apparatus of claim 1, wherein the EBG structure is a mushroom type EBG structure.

8. The apparatus of claim 1, wherein the EBG structure is integrated into the surface of the apparatus.

9. The apparatus of claim 1, wherein the EBG structure is attached to the surface of the apparatus using an adhesive such that the EBG structure is an EBG adhesive tape.

17. The method of claim 1, wherein a metallic coating directs the electromagnetic interference from the noise producing components throughout the entire chassis.

10. A method for constructing an electronic device with electromagnetic interference shielding, comprising:

forming an enclosure of the electronic device, where the enclosure includes an electromagnetic bandgap (EBG) structure;

locating an antenna and a plurality of noise producing components within the enclosure to block noise from the plurality of noise producing components from the antenna.

11. The method of claim 10, wherein the EBG structure is a mushroom type EBG structure.

12. The method of claim 10, wherein EBG structure is integrated with the enclosure.

13. The method of claim 10, wherein an arrangement of the EBG structure on the enclosure is generated during an industrial design of the enclosure.

14. The method of claim 10, wherein the noise producing components include at least a central processing unit (CPU), platform controller hub (PCH), memory device, panel timing controller, motherboard layout, or any combination thereof.

15. The method of claim 10, wherein the EBG structure is selected to mitigate a frequency band of the electromagnetic interference, to block a selective frequency of the electromagnetic interference.

16. The method of claim 10, wherein the enclosure includes a metallic coating that directs the electromagnetic interference away from the antenna.

18. A method for fitting an electronic device for electromagnetic interference shielding, comprising:

attaching an electromagnetic bandgap (EBG) adhesive tape to a surface within the electronic device to prevent noise from interfering with the operation of an antenna.

19. The method of claim 18, wherein the surface is a housing of the electronic device.

20. The method of claim 18, wherein the EBG adhesive tape includes a conductive adhesive layer.

21. The method of claim 18, wherein the EBG adhesive tape includes a mushroom type EBG structure.

22. The method of claim 18, wherein the surface is a portion of a housing of the electronic device.

23. The method of claim 18, wherein the surface is a heat sink, and the EBG adhesive tape is attached to one surface of the heat sink.

24. The method of claim 18, wherein the surface is a heat pipe, and the EBG adhesive tape is attached to one surface of the heat pipe.

25. The method of claim 18, wherein the surface is a heat spreader, and the EBG adhesive tape is attached to one surface of the heat spreader.