WIRELESS ENERGY TRANSFER FOR MOBILE DEVICE APPLICATIONS
First Claim
1. A current sensing system comprising:
- a printed circuit board, wherein the printed circuit board includes at least a first layer, a second layer, and a third layer;
a loop of conductive material, wherein the loop of conductive material includes a diameter D3 on the second layer; and
a coil of conductive material, wherein the coil of conductive material has at least 2 turns;
wherein the coil of conductive material occupies the first layer and the third layer with an outer diameter D1 and an inner diameter D2, connected through each of the first, second, and third layers;
wherein the loop of conductive material is coupled to the coil of conductive material.
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Accused Products
Abstract
A current sensing system and method for wireless energy transfer may include a printed circuit board, wherein the printed circuit board may include at least a first layer, a second layer, and a third layer. A loop of conductive material may be included, wherein the loop of conductive material may include a diameter D3 on the second layer. A coil of conductive material may be included, wherein the coil of conductive material may have at least 2 turns, wherein a majority of the coil of conductive material may occupy the first layer and the third layer with an outer diameter D1 and an inner diameter D2, connected through each of the first, second, and third layers. The loop of conductive material may be coupled to the coil of conductive material.
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Citations
12 Claims
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1. A current sensing system comprising:
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a printed circuit board, wherein the printed circuit board includes at least a first layer, a second layer, and a third layer; a loop of conductive material, wherein the loop of conductive material includes a diameter D3 on the second layer; and a coil of conductive material, wherein the coil of conductive material has at least 2 turns; wherein the coil of conductive material occupies the first layer and the third layer with an outer diameter D1 and an inner diameter D2, connected through each of the first, second, and third layers; wherein the loop of conductive material is coupled to the coil of conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification