IMAGE PICKUP UNIT FOR ENDOSCOPE

• US 20150305606A1
• Filed: 07/06/2015
• Published: 10/29/2015
• Est. Priority Date: 10/04/2013
• Status: Active Grant

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Corporation
• Inventors: KANEKO, Tomohisa
• Granted Patent: US 9,629,524 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/00114 Electrical cables in or with an endoscope
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: G02B 23/243 Objectives for endoscopes
• CPC Class Codes: G02B 23/2484 Arrangements in relation to a camera or imaging device processing or control of video signals generated by an endoscope H04N23/60, H04N23/70
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors

Abstract

An image pickup unit for endoscope of the invention includes: an image pickup device including on a front face a plurality of electrode pads aligned along one side face; and a circuit substrate having an end face from which a lead group, a distal end portion of which is bonded to the plurality of electrode pads, is extended, wherein the end face of the circuit substrate is disposed more rearward than a rear face of the image pickup device, the lead group includes a first lead constituted of at least one of a lead connected to an image pickup device reference electric potential and a dummy lead which does not include an electrical function, and another second lead, and the first lead is closer to the edge portion where the rear face and the side face of the image pickup device intersect than the second lead is.

Claims

1. An image pickup unit for endoscope, comprising an image pickup device including on a front face thereof a plurality of electrode pads aligned along one side face of the image pickup device, and a circuit substrate having an end face from which a lead group is extended, a distal end portion of the lead group being bonded to the plurality of electrode pads,

wherein the end face of the circuit substrate is disposed more rearward than a rear face of the image pickup device,

the lead group includes a first lead constituted of at least one of a lead connected to an image pickup device reference electric potential and a dummy lead which does not include an electrical function, and another second lead, and

a shortest distance between the first lead and an edge portion where the rear face and the side face of the image pickup device intersect is shorter than a shortest distance between the second lead and the edge portion.

2. The image pickup unit for endoscope according to claim 1, wherein

the first lead and the second lead are flying leads formed respectively by conductive layers disposed on a face of the circuit substrate, the face being close to a central axis of the image pickup unit for endoscope, and

the conductive layer constituting the first lead is thicker than the conductive layer constituting the second lead.

3. The image pickup unit for endoscope according to claim 2, wherein the first lead is disposed on an outermost side in the lead group.

4. The image pickup unit for endoscope according to claim 1, wherein the second lead is a lead for inputting and outputting a signal of the image pickup device.

5. The image pickup unit for endoscope according to claim 1, wherein

the first lead is a flying lead formed by a conductive layer disposed on a face of the circuit substrate, the face being close to a central axis of the image pickup unit for endoscope, and

the second lead is a flying lead formed by a conductive layer disposed on another face of the circuit substrate, the other face being far from the central axis of the image pickup unit for endoscope.

6. The image pickup unit for endoscope according to claim 5, wherein the second lead is a lead for inputting and outputting a signal of the image pickup device.

7. The image pickup unit for endoscope according to claim 1, wherein

the first lead and second lead are flying leads formed respectively by conductive layers disposed on a face of the circuit substrate, the face being close to a central axis of the image pickup unit for endoscope, and

the first lead is bent in a shape different from a bent shape of the second lead such that the first lead has a shape which takes a route to the electrode pads, the route being closer to the edge portion than a route of the second lead is to the edge portion.

8. The image pickup unit for endoscope according to claim 7, wherein the second lead is a lead for inputting and outputting a signal of the image pickup device.