MEMS Swtich with Internal Conductive Path
First Claim
1. A MEMS switch comprising:
- a substrate having a top surface;
an insulator layer formed on at least a portion of the top surface of the substrate, the insulator and substrate forming a base;
a cap;
bonding material securing the cap to the base to form an interior chamber, the cap forming an exterior region of the base that is exterior to the interior chamber;
a movable member having a member contact portion;
an interior contact, the member contact portion being configured to alternatively contact the interior contact, the movable member and interior contact being within the interior chamber;
an exterior contact at the exterior region of the base; and
a conductor at least partially within the insulator layer, the conductor electrically connecting the interior contact and the exterior contact, the conductor being spaced from and electrically isolated from the bonding material securing the cap to the base.
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0 Petitions
Accused Products
Abstract
A MEMS switch has a base formed from a substrate with a top surface and an insulator layer formed on at least a portion of the top surface. Bonding material secures a cap to the base to form an interior chamber. The cap effectively forms an exterior region of the base that is exterior to the interior chamber. The MEMS switch also has a movable member (in the interior chamber) having a member contact portion, an internal contact (also in the interior chamber), and an exterior contact at the exterior region of the base. The contact portion of the movable member is configured to alternatively contact the interior contact. A conductor at least partially within the insulator layer electrically connects the interior contact and the exterior contact. The conductor is spaced from and electrically isolated from the bonding material securing the cap to the base.
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Citations
20 Claims
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1. A MEMS switch comprising:
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a substrate having a top surface; an insulator layer formed on at least a portion of the top surface of the substrate, the insulator and substrate forming a base; a cap; bonding material securing the cap to the base to form an interior chamber, the cap forming an exterior region of the base that is exterior to the interior chamber; a movable member having a member contact portion; an interior contact, the member contact portion being configured to alternatively contact the interior contact, the movable member and interior contact being within the interior chamber; an exterior contact at the exterior region of the base; and a conductor at least partially within the insulator layer, the conductor electrically connecting the interior contact and the exterior contact, the conductor being spaced from and electrically isolated from the bonding material securing the cap to the base. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A MEMS switch comprising:
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a substrate having a top surface; an insulator layer formed on at least a portion of the top surface of the substrate, the insulator and substrate forming a base; a cap; bonding material securing the cap to the base to form an interior chamber; a movable member having a member contact portion; an interior contact, the member contact portion being configured to alternatively contact the interior contact, the movable member and interior contact being within the interior chamber; and a conductor at least partially within the insulator layer, the conductor having a generally planar portion and at least one via extending from the generally planar portion, one or more of the at least one via(s) electrically contacting the interior contact, the generally planar portion being substantially completely encapsulated by the insulator layer and the one or more via(s), the insulator layer electrically isolating the generally planar portion from the bonding material. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method of producing a MEMS switch, the method comprising:
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forming an insulator layer on a substrate to produce a base, the insulator layer containing a completely encapsulated interior conductor; removing a portion of the insulator layer after forming the insulator layer, removing forming a channel to expose the interior conductor; forming a conductive path through the channel to electrically connect with the interior conductor; forming, on the base, switch microstructure that is movable and configured to alternatively electrically connect with the interior conductor through the conductive path; and using a bonding material to secure a cap to the base, the base forming an interior chamber containing the switch microstructure, the interior conductor being spaced from and electrically isolated from the bonding material securing the cap to the base. - View Dependent Claims (18, 19, 20)
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Specification