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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MAINTAINING DEPOSITION APPARATUS

  • US 20150311062A1
  • Filed: 12/22/2014
  • Published: 10/29/2015
  • Est. Priority Date: 04/25/2014
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device, comprising:

  • forming an aluminum compound film on a surface of a process chamber by supplying an aluminum (Al) source to the process chamber, the surface contacting the aluminum source in the process chamber;

    disposing a wafer on a susceptor provided in the process chamber after forming the aluminum compound film; and

    forming a thin film for the semiconductor device on the wafer.

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