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CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD

  • US 20150311178A1
  • Filed: 04/27/2015
  • Published: 10/29/2015
  • Est. Priority Date: 04/28/2014
  • Status: Active Grant
First Claim
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1. A method for bonding a first wafer and a second wafer, comprising:

  • depositing a bond pad on a metal on the first wafer, the first wafer including an integrated circuit, and the second wafer including a MEMS device; and

    sequentially bonding the first wafer to the second wafer utilizing first and second temperatures;

    wherein the second wafer is bonded to the bond pad at the first temperature and wherein the bond pad and the metal are bonded at the second temperature.

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