ITC-IGBT AND MANUFACTURING METHOD THEREFOR
First Claim
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1. A method for fabricating an ITC-IGBT, comprising:
- preparing a heavily doped substrate;
forming a GexSi1-x/Si multiple quantum well strained superlattice layer on a surface of the heavily doped substrate by means of the molecular beam epitaxy process; and
forming a lightly doped layer on a surface of the GexSi1-x/Si multiple quantum well strained superlattice layer.
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Abstract
An ITC-IGBT and a manufacturing method therefor. The method comprises: providing a heavily doped substrate, forming a GexSi1-x/Si multi-quantum well strained super lattice layer on the surface of the heavily doped substrate, and forming a lightly doped layer on the surface of the GexSi1-x/Si multi-quantum well strained super lattice layer. The GexSi1-x/Si multi-quantum well strained super lattice layer is formed on the surface of the heavily doped substrate through one step, simplifying the production process of the ITC-IGBT.
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17 Claims
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1. A method for fabricating an ITC-IGBT, comprising:
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preparing a heavily doped substrate; forming a GexSi1-x/Si multiple quantum well strained superlattice layer on a surface of the heavily doped substrate by means of the molecular beam epitaxy process; and forming a lightly doped layer on a surface of the GexSi1-x/Si multiple quantum well strained superlattice layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An ITC-IGBT, comprising:
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a collector region; a GexSi1-x/Si multiple quantum well strained superlattice layer located on a surface of the collector region; and a lightly doped layer located on a surface of the GexSi1-x/Si multiple quantum well strained superlattice layer. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification