METHOD FOR MANUFACTURING A SOLAR CELL AND SOLAR CELL OBTAINED THEREWITH

• US 20150311359A1
• Filed: 08/29/2013
• Published: 10/29/2015
• Est. Priority Date: 08/29/2012
• Status: Abandoned Application

• Current Assignee: M4Si B.V.
• Original Assignee: M4Si B.V.
• Inventors: Luchies, Johannes Reinder Marc, Wolters, Robertus Adrianus Maria, Heres, Klaas
• Application Number:
  US14/424,844
• Publication Number:
  US 20150311359A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 31/02167 for solar cells
• CPC Class Codes: H01L 31/022425 for solar cells
• CPC Class Codes: H01L 31/022458 for emitter wrap-through [EWT] type solar cells, e.g. interdigitated emitter-base back-contacts
• CPC Class Codes: H01L 31/0272 Selenium or tellurium
• CPC Class Codes: H01L 31/0322 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
• CPC Class Codes: H01L 31/0445 including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/054 Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
• CPC Class Codes: H01L 31/072 the potential barriers being only of the PN heterojunction type
• CPC Class Codes: Y02E 10/52 PV systems with concentrators
• CPC Class Codes: Y02E 10/541 CuInSe2 material PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The method of manufacturing a solar cell, comprising the steps of providing a solar cell device comprising a semiconductor body (10) and having a first side (11) and an opposed second side (12), which first side is intended for capturing incident light and which second side is intended for assembly to a carrier, which solar cell device comprises a first contact region (13) in the semiconductor body (10) at one of the first (11) and the second side (12); applying an optically transparent structure (22) of electrically insulating material to at least one of the sides (11, 12) of the solar cell device, which structure is patterned to form an aperture to the first contact region (13); providing a contact structure (41, 42, 43) of electrically conducting material in said aperture by means of electrochemical deposition.

Claims

1. A method of manufacturing a solar cell comprising a solar cell device with an optically transparent structure, through which a contact structure extends to a first contact region in a semiconductor body of the solar cell device, which method comprises the steps of:

providing the solar cell semi-manufactured device having a first side and an opposed second side, which first side is intended for capturing incident light and which second side is intended for assembly to a carrier, which solar cell device is provided with a passivation layer on at least one of the first and the second side;

applying the optically transparent structure of electrically insulating, curable polymer material on top of the passivation layer to the first side and to the second side, so as to constitutes an encapsulation, wherein the application of the optically transparent structure comprises depositing a first layer, which acts as a sealing material for the underlying passivation layer,

curing the polymer material of the optically transparent structure, which structure is patterned to form an aperture, and is an integral part of and a protection for the solar cell device,

patterning the underlying passivation layer after deposition of the first layer, so as to expose the first contact region, and

providing the contact structure of electrically conducting material in said aperture by means of electrochemical deposition, which contact structure comprises a barrier layer, a conductor layer and an interface layer.

3. The method as claimed in claim 1, wherein the optically transparent structure and/or its first layer is patterned after its deposition.

4. The method as claimed in claim 3, wherein the patterning occurs by means of locally heating said optically transparent structure.

5. The method as claimed in claim 4, wherein the local heating is carried out by means of irradiating with a light source such as a laser.

6. The method as claimed in claim 1, wherein the passivation layer and the first layer are patterned with a single apparatus.

7. The method as claimed in claim 6, wherein the first layer and the passivation layer are consecutively patterned with different wavelengths.

8. The method as claimed in claim 1, wherein the application of the optically transparent structure further comprises depositing a second layer with a thickness in a micrometer range.

9. The method as claimed in claim 8, wherein said second layer is patterned with a different pattern than the first layer.

16. The method as claimed in claim 1, further comprising providing conductor means electrically coupling the contact structure to at least one terminal and/or further contact of the solar cell, said conductor means provision comprising forming an electrical conductor running over or in channels in said optically transparent structure and being connected to said contact structure.

17. The method as claimed in claim 16, wherein the electrical conductor extends from the first side to the second side of the solar cell device.

18. The method as claimed in claim 17, wherein the electrical conductor extends to a further contact at the second side of the solar cell.

22. The method as claimed in claim 1, wherein the optically transparent structure comprises additives for enhancing optical transmission.

2. (canceled)

10-15. -15. (canceled)

19-21. -21. (canceled)

23. (canceled)

24. A solar cell comprising a solar cell device provided with a semiconductor body with a first contact region and a passivation layer thereon, which solar cell device is provided with a first side and an opposed second side, which first side is for capturing incident light and which second side is for assembly to a carrier, wherein the solar cell further comprises:

a patterned optically transparent structure of insulating, cured polymer material, which is present on the passivation layer on at least the first side of the solar cell device, wherein a first layer of the optically transparent structure constitutes a sealing material of the passivation layer, and wherein the optically transparent structure constitutes an encapsulation and extends on both the first side and the second side of the solar cell device;

a contact structure connected to the first contact region, which comprises a barrier layer, a conductor layer and an interface layer, which contact structure extends through the patterned optically transparent structure and through the passivation layer and is electrochemically deposited.

26. The solar cell as claimed in claim 24, further comprising a first terminal coupled to the contact structure through conductor means, which comprises a conductor running over the optically transparent structure or in channels in said optically transparent structure at the first side of the solar cell device.

27. The solar cell as claimed in claim 24, further comprising a further contact at the second side of the solar cell device, which further contact is coupled to the contact structure through conductor means, which comprises a conductor running over the optically transparent structure or in channels in said optically transparent structure at the first side of the solar cell device and extending to the second side of the solar cell device.

28. The solar cell as claimed in claim 24, wherein the semiconductor body comprises at least one amorphous semiconductor layer, so as to define a solar cell of for instance a bifacial cell type or a HIT cell type.

29. The solar cell as claimed in claim 24, wherein the solar cell device is of the inter-digitated back contact (IBC) or hetero junction back-contact (HJ-BC) type and comprises inter-digitated first and second terminals at the second side, the first terminals being coupled to first contact regions in the semiconductor body, said first contact regions being doped with charge carriers of a first conductivity type, which second terminals are coupled to second contact regions in the semiconductor body, the second contact regions being doped with charge carriers of a second conductivity type opposed to the first conductivity type.

30. The solar cell as claimed in claim 24, wherein the solar cell device is of the thin-film type (CdTe, CIGS, etc).

41. The solar cell as claimed in claim 24, wherein the conductor comprises copper or a copper alloy.

25. (canceled)

31-40. -40. (canceled)

42. A method of manufacturing a solar cell comprising a solar cell device with an optically transparent structure, through which a contact structure extends to a first contact region in a semiconductor body of the solar cell device, which method comprises the steps of:

providing the solar cell semi-manufactured device having a first side and an opposed second side, which first side is intended for capturing incident light and which second side is intended for assembly to a carrier, which solar cell device is provided with a passivation layer on at least one of the first and the second side;

applying the optically transparent structure of electrically insulating, curable polymer material on top of the passivation layer, wherein the application of the optically transparent structure comprises depositing a first layer, which acts as a sealing material for the underlying passivation layer,

curing the polymer material of the first layer of the optically transparent structure, which first layer is patterned to form an aperture, wherein the optically transparent structure is an integral part of and a protection for the solar cell device,

patterning the underlying passivation layer after deposition of the first layer, so as to expose the first contact region, and

providing the contact structure of electrically conducting material in said aperture by means of electrochemical deposition, which contact structure comprises a barrier layer, a conductor layer and an interface layer.