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METHOD AND APPARATUS FOR DETECTING FAULT IN THE SEMICONDUCTOR MENUFACTURING PROCESS AND RECORDING MEDIUM THEREOF

  • US 20150318221A1
  • Filed: 11/26/2014
  • Published: 11/05/2015
  • Est. Priority Date: 05/02/2014
  • Status: Abandoned Application
First Claim
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1. A method of detecting a fault in a semiconductor manufacturing process, the method comprising:

  • obtaining measured data and reference data regarding at least one parameter related to semiconductor manufacturing conditions in a process included in a semiconductor manufacturing process during a pre-set period of time;

    converting the measured data and the reference data by using at least one principal component parameter obtained via principal component analysis with respect to the measured data and the reference data;

    calculating a similarity between the converted measured data and the converted reference data; and

    detecting a fault in the process based on the calculated similarity.

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