LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

• US 20150318328A1
• Filed: 07/13/2015
• Published: 11/05/2015
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: LuxVue Techonology Corporation (Apple Inc.)
• Inventors: Bibl, Andreas, Sakariya, Kapil V., Griggs, Charles R., Perkins, James Michael
• Granted Patent: US 9,865,832 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G09G 3/006 Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309
• CPC Class Codes: G09G 3/3208 organic, e.g. using organic light-emitting diodes [OLED]
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/2401 Structure
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/2405 Shape
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/245 Material
• CPC Class Codes: H01L 2224/29005 Structure
• CPC Class Codes: H01L 2224/29109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29113 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/29118 Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/29124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/29155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/32014 : the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32057 : in side view
• CPC Class Codes: H01L 2224/32237 : the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32503 : comprising an intermetallic compound
• CPC Class Codes: H01L 2224/75252 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75301 : Bonding head
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/75725 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/759 : Means for monitoring the connection process
• CPC Class Codes: H01L 2224/7598 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/82101 : by additive methods, e.g. direct writing
• CPC Class Codes: H01L 2224/82102 : using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/82104 : using screen printing
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83193 : wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83805 : involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/8381 : involving forming an intermetallic compound at the bonding interface
• CPC Class Codes: H01L 2224/83825 : Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/8383 : Solid-solid interdiffusion
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/1214 : comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/053 : Oxides composed of metals from groups of the periodic table
• CPC Class Codes: H01L 2924/0543 : 13th Group
• CPC Class Codes: H01L 2924/0544 : 14th Group
• CPC Class Codes: H01L 2924/0549 : being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H10K 50/00 : Organic light-emitting devices integrated devices or assemblies of multiple devices H10K59/00, H10K65/00; organic semiconductor lasers H01S5/36
• CPC Class Codes: H10K 59/10 : OLED displays
• CPC Class Codes: H10K 59/12 : Active-matrix OLED [AMOLED] displays

Abstract

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Claims

1. A display panel with redundancy scheme comprising:

a display substrate including a pixel area that includes an array of subpixels;

an array of redundant micro LED device pairs within the array of subpixels, wherein each subpixel includes a redundant micro LED device pair, and each redundant micro LED device pair within a respective subpixel is designed to emit a same primary color emission; and

one or more top electrode layers in electrical contact with the array of redundant micro LED device pairs;

wherein the array of supixels includes a first subpixel array, a second subpixel array, and a third subpixel array, wherein the first, second, and third subpixel arrays are designed to emit different primary color emissions.

2. The display panel of claim 1, wherein the first subpixel array is designed to emit a red primary color emission, the second subpixel array is designed to emit a green primary color emission, and the third array subpixel array is designed to emit a blue primary color emission.

3. The display panel of claim 1, wherein each micro LED device has a maximum width of 1 to 100 μ

m.

4. The display panel of claim 3, wherein each micro LED device comprises a semiconductor material.

5. The display panel of claim 4, wherein each micro LED device includes a p-doped layer, an n-doped layer, and a quantum well layer between the p-doped layer and the n-doped layer.

6. The display panel of claim 1, further comprising circuitry to switch and drive the array of subpixels.

7. The display panel of claim 6, further comprising:

one or more micro LED device irregularities within the array of redundant micro LED device pairs, the irregularities selected from the group consisting of a missing micro LED device, a defective micro LED device, and a contaminated micro LED device.

8. The display panel of claim 7, further comprising a passivation layer material covering the one or more irregularities.

9. The display panel of claim 8, wherein the one or more top electrode layers do not make electrical contact with the one or more irregularities.

10. The display panel of claim 7, further comprising one or more cuts in the one or more top electrode layers to electrically disconnect the one or more micro LED device irregularities from a ground tie line running between the array of subpixels.

11. The display panel of claim 7, wherein each subpixel includes a first landing area and a second landing area, and a first micro LED device of a respective redundant micro LED device pair is bonded to the first landing area and a second micro LED device of the respective redundant micro LED device pair is bonded to the second landing area.

12. The display panel of claim 11, wherein the first landing area is electrically disconnected from the circuitry.

13. The display panel of claim 12, wherein the first landing area is cut to electrically disconnect the first landing area from the circuitry.

14. The display panel of claim 11, wherein the circuitry is contained within an array of micro controller chips.

15. The display panel of claim 14, wherein the array of micro controller chips is bonded to the display substrate.

16. The display panel of claim 15, wherein each micro controller chip is bonded to the display substrate within the pixel area.

17. The display panel of claim 16, wherein each micro controller chip is connected to a scan driver circuit and a data driver circuit.

18. The display panel of claim 11, wherein the working circuitry is contained the display substrate.

19. The display panel of claim 1, wherein the one or more top electrode layers is a single top electrode layer in electrical contact with the array of redundant micro LED device pairs.

20. The display panel of claim 19, wherein the single top electrode layer is in electrical contact with a plurality of ground tie lines running between the array of subpixels through a plurality of openings formed in a planarization layer.